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SR100 - Intel® 4 Gen. Core™ i7 MIL-STD Fanless Rugged System

SR100 - Intel® 4 Gen. Core™ i7 MIL-STD Fanless Rugged System

Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7 Haswell Processor, 9V to 36V DC-in, Wide Temp. -40°C~70°C

  • 4th Generation Intel® Core™ i7 Haswell processors (BGA)
  • XR-DIMM up to 8 GB RAM
  • Onboard uSSD SATAIII up to 64 GB
  • Multi-Displays by 2 x DP, 1 x DVI-I
  • 2 x mPCIe Expansion slot (One Co-Layout with mSATA)
  • 2 x PCIe Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM ports
  • 9V~36V DC-in with power delay on/off
  • Extended Temperature -40°C to 70°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
  • Video

Introduction

The SR100 based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR100 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR100 is based on EBX form factor which features with stackable PCIe/104 and FPE expansions, on board Nano SATA(3.0)16/32 Giga Byte SSD and Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0, 1 COM port and 2 mPCIe Expansion slots (one co-layout with mSATA). SR100 supplies wide power voltage from 9 to 36V DC-in.

SR100SR100 back

Unique Features

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Effective cooling solution for thermal design

STACKRACK implements unique cooling solution on SR100 to achieve maximum heat dissipation with copper heat spreader, pure copper heat pipe and aluminum heat sink. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100 can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C.
 

MIL-STD-810G standard designed for shock and vibration

SR100 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR100 designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration.
 

Stackable with PCIe/104 & FPE expansion

Known for application ruggedness, reliability, sealing properties, and compactness characteristics, PCIe/104 & FPE connectors are ideal for high-end electronic equipment and use in extreme environment conditions. With easy connect/disconnect and blind mating, SR100 has a functional life greater than 10,000 mating cycles. The PCIe/104 connector on SR100 that specifies standard of SAMTEC Q2™ QMS/QFS series in a three bank (156-pin) orientation for module stacking. SAMTEC designed the QMS/QFS series with a 15.24 mm stack height for top and bottom board stacking. And the Q2™ has triple the wipe of many high-speed mezzanine interconnects making SR100 the best choice for tough environmental conditions.

 

System main board: EBX SBC-OXY5737A

1. Intel Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard.With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lowerresistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

2. Expandable by Extension Storage Module, the SK401

SR100 carries stacking PCIe 104 and FPE expansion slot, which allows the system with optional module connects ability to increase a variety of possibility for device, connects. SR100 can use with stackable storage module SK401. With SK401 storage module stacking on board can additionally support 2x 2.5”SSD or HDD and 2x mSATA. The SK401 supports OS of Win 7, Win XP, Linux, DOS, etc.

3. Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR100 supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

 

Operating Temp.
-40°C~70°C
System
CPU Intel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz GHz), 6M Cache (47W)
Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device 1 x SATA III 6 Gb/s, 2.5" SSD/HDD
Ethernet Chipset Intel® I210IT & i217LM GbE
Front I/O
Power Button 1 with backlight
Power LED 1
HDD LED 1
LAN LED 2 sets
USB 2 x USB 3.0
POWER 1 x Terminal Block
Rear I/O
DisplayPort 2 x 20-pin DP connector (female)
DVI-I 1 x 29-pin DVI-D connector (female)
Ethernet 2 x RJ45 ports
Audio Mic-in, Line-out
COM 1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
Audio 1 x MIC, 1 x Line out
USB 2 x USB 3.0
Display
Display Interface DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
Display port interface x 2: 20-pin display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics Controller Onboard Intel® HD 4600 graphics
OS support list
Windows Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
Mechanical and Environment
Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension 250 x 149 x 76 mm
Weight 3.4 Kg (7.48 lbs)
Operating Temp. -40°C to 70°C(ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE and FCC compliance
Green Product RoHS, WEEE compliance

The rugged MIL-STD compliant system, SR100 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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evice Model SR100
Tester Ian Huang
Test Result Pass
Test Temperature High 0°C~75°C / Low -40°C~0°C
Test Time 9Hours / 1.5Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can't halt.
Test Configuration

Device

Configuration

CPU

Intel® Core i7-4700EQ 2.40GHz

PCH

Mobile Intel QM87 Express Chipset

Memory

Swissbit XR-DIMM 4 GB DDR3-1600

port3 SATAII

Innodisk 3ME3 mSATA 64GB

port4 SATA II

Apacer 64GB Onboard SSD

LAN1

Intel(R) I210 Gigabit Network Connection

LAN2

Intel(R) I217-LM Ethernet Connection

Test Software

Burnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 4.3.0.11

Chamber

KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performanceunder high temperature, thus STACKRACK conducts long time experiments tomake sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR100 for one hour, from 50°C to 85°C.

NEW_STYLE_products_SR100_CPU02

 

SR100 MB HeatSink - IO Performance

Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C 75°C
CPU T-J 0 80 81 89 94 99 99 100 100 100
CPU Die -24.3 66.4 70 75.7 83 89 88.1 93.9 95.6 98
Heatsink -32.8 58 60.5 65.5 72.3 77.7 77.9 84.7 875 90.7
Δ1=(TJ-Die) 24.3 13.6 11 13.3 11 10 10.9 6.1 4.4 2
Δ2=(Die-Sink) 8.5 8.4 9.5 10.2 10.7 11.3 10.2 9.2 8.6 7.3
CPU Frenquency (GHz) 2.79 2.79 2.79 2.79 2.79 2.60 2.59 2.00 1.6 1.1

 

 

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Test Result

Image removed.Innodisk 3ME3 mSATA 64GB (Read) MB/s

Image removed.Innodisk 3ME3 mSTAT 64GB (Write) MB/s

Image removed.Apacer OnBoard SSD 64GB (Read) MB/s

Image removed.Apacer OnBoard SSD 64GB (Write) MB/s

SR100 MB HeatSink - IO Performance

Point -40°C -20°C 25°C 40°C 50°C 55°C 60°C 65°C 70°C 75°C
Innodisk 3ME3 mSATA 64GB ( Read ) MB/s 187.16 190.43 187.34 186.99 187.29 185.91 187.43 187.42 187.43 187.39
Innodisk 3ME3 mSATA 64GB ( Write ) MB/s 121.43 119.42 118.15 118.09 118.49 118.02 117.94 117.84 118.32 118.71
Apacer OnBoard SSD 64GB (Read) MB/s 132.17 127.4 136.16 132.66 127.37 130.6 132.98 126.62 130.63 124.89
Apacer OnBoard SSD 64GB (Write) MB/s 256.41 255.21 257.25 255.82 256.26 255.39 257.25 256.04 253.55 255.99

Effective cooling solution for maximum heat dissipation

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C

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NEW_STYLE_products_SR100_Thermal02

 

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Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000

Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

OXY5737A

EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.

Copper Heat spreader

Copper heat spreader directly touches the heat source- processor and chipset, which absorb heat rapidly and transfer to heat pipe.

• 99.9% purity of copper, weigh 80g and consume 80x45x3 mm
• 3mm height to fulfill the gap between mainboard and heatsink enclosure