ROC100-XD2

With the rise of new technologies and data-driven services, people and devices that consume and generate data are growing exponentially, from smart phones to IOT-enabled industrial equipment to autonomous car. This rapid growth of data requires advanced intelligence closer to the endpoint that are both generating and consuming data. As the needs of the edge become more complex and varied, some services and applications will require a different balance of performance, power consumption and size.

Unleashing the future of computing at edge, the ROC100-XD2 in a extreme compact size, is able to expand the powerful capabilities of the data center outward, deliver more powerful services and reduce application latency by processing more data closer to the edge.

Fueled by the sheer prowess of the Intel® Xeon D-2100 (up to 16 Cores), 2x 10GbE T-base (Intel® X722), ROC100-XD2 isn't just an AI server – it's a Pint-sized powerhouse of dynamic sensor fusion marvel. Built on the robust foundation of Intel hardware, this solution rides the cutting edge with OpenVINO and REALSENSE technology, creating a symphony of innovation. Intel’s open-source software-defined platform propels the ROC100-XD2 to not only perceive its surroundings with unparalleled efficiency but also respond in real-time to the dynamic demands of the modern landscape. With AI workloads meticulously optimized, the ROC100-XD2 is your gateway to a future where responsiveness meets intelligence, seamlessly shaping the landscape of innovation.

Features

Computing Features

-Intel® Xeon D-2100 Processors (up to 16 cores)

-Up to 256GB/512GB DDR4 RDIMM/LRDIMM

-Dual 10G RJ45 T-base (Intel® X722)

-Graphics controller via ASpeed AST2500

-Support IPMI

-12V DC-IN

-MIL-STD 810 Thermal, shock, vibration, Humidity

-Extended operating temperature. -20°C to 60°C

Ultra-High Performance Intel® Xeon® Performance with 

 

The Intel® Xeon D-2100 Processors brings the advanced intelligence of the intel® Xeon® Scalable processor architecture into an optimized, dense, lower-power system-on-a-chip(SoC) form factor for environments constrained by space and power. 

With a range of 4 to 18 cores, up-to 512 GB of addressable memory, this system-on-a-chip (SoC) has an integrated platform controller hub (PCH), integrated high-speed I/O, up-to four integrated 10 Gigabit Intel" Ethernet ports, and a thermal design point (TDP) of 60 watts to 110 watts. It can run the same instruction set as more robust Intel Xeon Scalable processors to provide software consistency and scale from the data center to the edge.

Design to Meet MIL-STD 810, MIL-STD461

ROC100-XD2 is designed to meet strict size, weight, and power (SWaP) requirements and to withstand harsh environments, including temperature extremes, shock/vibe, sand/dust, and salt/fog.

ROC100-XD2 is MIL-810 compliant rugged Edge AI Inference server. It passes numerous environmental tests including Temperature, Altitude, Shock, Vibration, Voltage Spikes, Electrostatic Discharge and more. The sealed compact chassis shields circuit cards from external environmental conditions such as sand, dust, and humidity.

Block Diagram