SCH3X2-RDC

SCH3X2_1_IEC-61850-3
SCH3X2_2_IEEE-1613
SCH3X2_3_Substation
SCH3X2_4_Micro Grid

IEC-61850-3, IEEE-1613 Micro-Grid Fanless Computer, with Intel® Core™ 13/12th Gen. i9/i7/i5/i3 Processors, expansion 2 x PCIe Gen4 x 8, DC-IN 16~31V with Redundant, operating Temperature -20°C to 60°C

  • Intel® 13th/12th Gen Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 up to TDP 65W
  • Up to 64G DDR4 SO-DIMM 3200 MHz
  • 2 x DP, 2 x LAN, 2 x USB
  • 2 x 2.5” Easy swap SSD Tray
  • 2 x PCIe Gen4 x 8 slot
  • DC-IN 16~31V with redundant
  • Operation Temp. -20°C to 60°C
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  • Specifications
  • Order Information
  • Certification
System
CPU Intel® 13th/12th Gen Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 up to TDP 65W
Memory Capacity Up to 64G DDR4 SO-DIMM 3200MHz
Chipset Q670
Display
GPU Intel® UHD Graphics
Display Port DisplayPort 1.4, DP++ Max resolution up to 4K( 4096 x 2304@60Hz)
2nd Display Port DisplayPort 1.4, DP++ Max resolution up to 4K( 4096 x 2304@60Hz)
Expansion
PCIe Slot 2 x PCIe Gen 4 x 8 Slot
M.2 1 x M.2 2280 M-Key (PCIe Gen3 x 4, SATAIII)
Storage
SATA Up to 4TB SATAIII
M.2 Up to 2TB NVMe & SATAIII
Ethernet
Ethernet

Intel® I219-LM Giga LAN
Front I/O
Power Button 1 x Power Button
Indicator 1 x HDD backlight / 1 x Power backlight
USB3.0 2 x USB3.0
Rear I/O
Power Input

1 x 4P Terminal Block 9~36V DC-IN

(2 x  4P Terminal Block 9~36V DC-IN with Redundant)
LAN 2 x 1GbE RJ45
USB3.2 2 x USB3.2
USB2.0 2 x USB2.0
Display Port 2 x DP
Storage 2 x 2.5" Swap SSD Tray
Power Requirement
Power Input DC-IN 16~31V with redundant
OS support list
OS Window® 11 64 bit, / Window® 10 IoT LTSC 64 bit (LTSC 2021) / Ubuntu 22.04 / Linux (support by request)
Mechanical and Environment
Dimension 220 x 315 x 167 mm (W x D x H)
Operating Temp -20°C to 60°C
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
System Design  Fanless
Certification
IEC-61850-3 / IEEE-1613 / UL 62368-1 / EN60945 / CE/FCC

SCH3X2-DC