OXY5323A
3.5" SBC Intel® Apollo Lake Atom / Celeron /Pentium BGA processor, 1 x DDR3L SO-DIMM, 6 x USB, 4 x COM, 8~24V DC-IN, -20 to 70°C, -40 to 85°C (Optional)
- Intel® Apollo Lake Atom / Celeron /Pentium BGA processor
- 1 x DDR3L SO-DIMM and support up to 8GB
- Support triple display for HDMI, VGA and LVDS / eDP
- 1 x Mini PCIe + 1 x M.2 slot
- 2 x SATAIII (1 x SATA is multiplexed with 1 x mSATA port)
- 2 x Intel® Gigabit Ethernet
- 2 x USB 2.0, 4 x USB 3.0 and 4 x COM
- 8~24V wide voltage power input
- mPCIe with SIM card holder
- Technical Profile
- Specifications
- Certification
- Introduction
-
OXY5323A is a highly integrated 3.5" rugged SBC driven by Intel® Apollo Lake Processor. It features rich I/O interface, such as: 4 COM Ports; 2 LAN Ports; 6 USB Ports. Support triple display for HDMI, VGA and LVDS / eDP, OXY5323A can fulfill diverse needs of modern day display & monitor control applications. Moreover, OXY5323A can avoid damage from sudden surge of voltage with its 8V to 24V wide range DC input design.
- Rich I/O interface – Extensive Functionality
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Rich I/O design endows OXY5323A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 4 COM, 6 USB, 2 LAN, and triple display for HDMI, VGA and LVDS / eDP, OXY5323A provides a wide array of choices to expand and connect to different devices.
- Extended Temperature Operation
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PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5323A can operate from -20°C to 70°C , our strict manufacture procedure guarantees supreme performance in severe environment.
- Efficient thermal solution
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A tailor-made heat spreader is what PERFECTRON provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5323A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.
System |
|
---|---|
CPU |
Intel® Apollo Lake-M N3350/N4200 Processor |
Memory type |
DDR3L 1866MHz, 1 x 204-pin SO-DIMM, Max. 8GB (Non-ECC) |
Chipset |
Intel® SoC Integrated |
Graphics |
Intel® HD Graphics |
Ethernet |
2 x Intel® I210-IT Giga LAN |
Audio> |
Realtek® ALC662 |
I/O Chipset |
Nuvoton NCT6116D |
TPM |
Nuvoton NPCT650ABCYX TPM2.0 (Optional) |
Expansion Slot |
Storage: Mini PCIe Full size (USB / PCIe / SATA), w/ SIM Card Holder Wireless: M.2 2230 E-key (PCIe / USB) |
BIOS |
AMI BIOS |
H / W Monitor |
Temperature Monitor, Voltage Monitor |
Watchdog Timer |
1 to 255 Steps by Software Program |
Smart Fan Control |
CPU Fan |
Graphics |
|
VGA |
Up to 1920 x 1200 @60 Hz |
HDMI |
Up to 4K (3840 x 2160) @30 Hz |
LVDS |
Up to 1920 x 1200 @60 Hz |
eDP (Option) |
Up to 4K (3840 x 2160) @60 Hz |
Rear I/O |
|
USB |
4 x USB 3.0 |
Display I/O |
1 x HDMI 1.4, 1 x VGA |
LAN I/O |
2 x RJ-45 |
Internal Connectors |
|
Storage | 2 x SATAIII ( 1 x SATA is multiplexed with 1 x mSATA port) |
USB | 2 x USB 2.0 |
Display I/O |
1 x LVDS, 1 x eDP 1 x Backlight Connector |
Audio I/O | 1 x Audio Header (Front Panel Mic-in & Line-out) |
Serial Port | 4 x RS232 (One Supports RS232/422/485) |
GPIO | 1 x MiAPI Header (Programmable. Support 10bit GPIO) |
Fan | 1 x 4-pin CPU Fan Header |
Power | 1 x 8~24V ATX Power Connector, 1 x AT/ATX Mode Select Jumper |
Others | 1 x CMOS Jumper |
Power Requirement |
|
Power Input | 8~24V Wide Range DC Input w/4-pin ATX connector (Pitch: 4.2mm) |
Environmental |
|
Operating Temperature |
-20 to 70°C (Optional -40 to 85℃) |
Storage Temperature | -40 to 85°C |
Operating Humidity | 10% to 95% R/H, non-condensing |
Standard Compliance |
|
Standard Compliance | CE/FCC |
OS |
|
OS Support |
Windows® 10 64-bit |
Linux(Support by request) |