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Fanless Rugged System with Intel® Core i5-3610ME Processor 12V DC-in, Wide Operating Temp. -40°C to 60°C

  • 3rd Generation Intel® Core™ i5-3610ME processor (BGA)
  • Intel® QM77 Express Chipset
  • 4 x Rugged M20 Ethernet Ports
  • Multi-Display By DVI-D and VGA
  • Swappable 2.5" HDD/SSD Design
  • 2 x USB, 2 x COM(1 x RS232/422/485, 1 x RS232)
  • 12V DC-IN
  • Wide Operating Temp. -40°C to 60°C
  • Technical Profile
  • Specifications
  • CPU
  • SSD Performance
  • Thermal Solution

The high performance system in PERFECT series, PER335B featuring Intel® 3rd gen Core™ i5-3610ME Processor which support clock speed 2.7GHz up to 3.3GHz. PER335B provides rich I/O interface with 4 x Rugged M20 Ethernet Ports, Multi-Display 1 x VGA and 1 x DVI-D and 3 x 2.5" HDD/SSD. It support 1 x DDR3 SO-DIMM up to 8GB, 2 x Mini PCIe (1 supported with mSATA). The wide range operating temp from -40℃ to 60℃.

The M20 connector features its higher capability in waterproof and resistant durability, which match perfectly for the usage in harsh environment, such as for the railway solution. In railway solution, rich M20 ports allow the multi usage in the same time as a Backbone Network. M20 provides system combination for multiple sub-systems in railway, the combination of Audio Public Address & Intercom Call (APAIC), Passenger Information Display System (PIDS), Video surveillance / Closed-circuit television (CCTV) and so on. Multi-Display by DVI-D and VGA adapt different customer demand. Moreover, for the storage device, PER335B possess 3 swappable 2.5" HDD/SSD and a SATA DOM, more flexible to fulfil the customization.

Advanced thermal technology and vibration resistance capability

A unique design tightly integrates the electrical, thermal and mechanical components into a complete system with no compromise to any one segment. It was designed for applications where severe environments and high performance meet. The PER335B’s thermal solution designed with an aluminum heat sink and a copper vacuum tube liquid-vapor (Heat-Pipe) which is efficiently manage the heat dissipation. This rugged mechanical structure is also providing better vibration resistance ability to remain the PER335B has perfect computing


PER335B pic03



Operating Temp.

-40°C to 60°C


CPU Type

Intel® Core™ i5-3610ME Processor

(3M Cache, up to 3.30 GHz)


Intel® QM77

Memory Type

2 x DDR3 SO-DIMM up to DDR3-1600 8GB SDRAM

Expansion Slot

2 x Mini PCIe (1 supported with mSATA)

Storage Device

3 x 2.5" HDD/SSD



2 x Intel I210-IT Gigabit Ethernet 1 x Intel 82579LM Gigabit Ethernet 1 x Intel 82574L Gigabit Ethernet

Front I/O


1 x VGA connector


1 x DVI-D Connector


4 x M20 Connectors

Serial Port

2 x DB9 (1 x RS-232/422/485, 1 x RS-232)


2 x USB3.0 standard-A connectors 2

Power Button



1 x 3 pin Terminal Block

Applications, Operating System


Embedded Computing, Process Control, Intelligent Automation and manufacturing applications, Railway surveillance, Passenger information system, Driver Machine interface, Train management and applications where Harsh Temperature, Shock, Vibration, Altitude, Dust, Damp and EMI Conditions.

Operating System

Microsoft Windows 7 32/64Bit,

Microsoft Windows 8 32/64Bit,

Microsoft Windows 10 32/64Bit,


Ubuntu13.10 Ubuntu14.04,

Fedora 20

Mechanical and Environment

Operating Temp.

-40°C to 60°C (-40°F to 140°F)

Storage Temp.

-40°C to 85°C (-40°F to 185°F)


10% to 90% RH non-condensing


CE and FCC compliance

Green Product

RoHS, WEEE compliance

Power Type

DC 12V


Dimension (W x D x H)

298 x 201 x 129 mm

(11.7" x 7.9" x 5.1")


4.6 kg (10.13 lbs)


Aluminum Alloy,

Steel Plate Cold-Rolled Coil


Test Result

TR PER335B_0

Test Configuration
 Device  Device Information  Manufacturer  Part Number

 Intel® Core™ i5-3610ME Processor 2.7GHz
 (up to 3.3GHz)

 Intel  i5-3610ME
 PCH  Intel HM76  Intel  HM76
 Memory DIMM  innodisk 2GB EP3L SLV04G64A1BB1SA-DCRT  Innodisk  SLV04G64A1BB1SA-DCRT
 SATA Port1  Innodisk SATA SSD 3MG2-P ATA 1TB  Innodisk  
 SATA Port2  Innodisk SATA SSD 3MG2-P ATA 1TB  Innodisk  
 SATA Port3  Innodisk SATA DOM-SH 3ME3 V2 ATA 64GB  Innodisk  3ME3 V2 ATA 64GB
 LAN1  Intel®82579LM GbE LAN  Intel  82579
 LAN2  Intel® 82574L GbE LAN  Intel  82574
 LAN3  MT321_Intel® I210 GbE LAN  Intel  I210
 LAN4  MT321_Intel® I210 GbE LAN  Intel  I210
 Test Software  Burnin test v6.0、AS SSD、 Intel Extreme Tuning
 Chamber  KSON THS-b4t-150  KSON





Effective cooling solution for maximum heat dissipation:

PERFECTRON implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, PER335B can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.

PER335B pic01


Patent Designed Heat Sink
The heat sink is made by heat radiating material which is also combining with special CNC cutting, further forged into high efficient heat dissipation metal.


  • 96 % of aluminum, 28 mm height and weighs 1.03kg


Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for efficient dissipation. Heat pipe transfers heat from the heat sources to the heat sink over relatively long distancheat transfer involves the liquid-vapor phase change of a working fluid.


Copper Heat spreader
Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure


  • 99.9% purity of copper, weigh 515g



Thermal Pad

After countless experiments, PERFECTRON’s experienced engineer team has learned valuable lessons about the perfect thickness of thermal pad from failures.


  • Precise design of thermal pad: the gap between CPU die and heat sink should be less than 1mm.



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