OXY5740A

PERFECTRON provides customized thermal kit for motherboard based on evaluation of each motherboard in term of thermal and mechanical design. Heat spreaders are used to transfer heat from heat generating point to heat sink, and heat sink cools down device's temperature by dissipating heat into surrounding air.



PERFECTRON's specially designed heat sink reaches best heat dissipation via wave line on the interface, which increases up to 30-40% air contact area. The exclusive thermal designs are able to replace traditional fan, as well as ensure high reliability and stability while working under wide range temperature from -40 to 70°C.

OXY5740A's rich I/O provides embedded system developers with diverse embedded applications. It features multiple displays, including 2 x DisplayPort and DVI-D display port with dual channel 24bit LVDS. OXY5740A also reserves various expansion flexibility: StackPC + FPE for Stackable PCIe/104 module expansion; 1 x Full-size mPCIe/mSATA and 1 x Half-size mPCIe for compact and rugged storage option. The board further includes four COM ports, eight USB ports, two Gbe LANs and two SATAIII, helping system integrators develop solutions quickly.

OXY5740A has key components soldered onboard to eliminate risk of harm caused by vibration. Rugged XR-DIMM RAM option enhances drastically the resistance to vibration as well as shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by installing extra cards. The cable-free operation removes the concern of loosening cable connections due to shock & vibration. With fundamental components soldered onboard and a solid PCIe/104 connection, OXY5740A serves as a perfect solution for critical application and harsh environment.

Installation Instruction Procedure:

Stick thermal pad on CPU and chipset, then simply place passive heat sink on thermal pad. Two budges are specially designed at the bottom, contacting directly with CPU and chipset to absorb heat efficiently from the bottom layer, then spread the collected heat to upper aluminum heat sink. After transferring heat from bottom layer to heat sink, high and low fin design create airflow along with wave line to dissipate heat.