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19” 1U Rack-mount Intel® QM77 Fanless Rugged System with Core i7/i5/i3 processors, 9V to 24V DC-in, Extended Temperature. -40°C to 70°C

  • •Intel® Ivy Bridge i7/i5/i3 CPU + Intel QM77 PCH
  • •2 x 204 pin SO-DIMM DDR3 1333/1600 up to 16 GB
  • •Rich I/O interface with 1 COM, 6 USB, 2 LAN (RJ45)
  • •Supports 2.5” SATA HDD/SSD
  • •Flexible expansion with 1 x miniPCIe, 2 x PCI
  • •9 – 24V wide voltage DC-in design
  • •Multi-display: 1x DVI, 1 x VGA, 1 x HDMI
  • •Extended operating temperature. -40°C to 70°C
  • Technical Profile
  • Specifications
  • CPU
  • SSD Performance
  • Thermal Solution
  • Certification

ROC235A is an industrial 19” 1U Rack-mount fanless rugged system, suitable for demanding industrial embedded applied applications. Powered by Intel® Ivy Bridge i7/i5/i3 (i7-3610QE, i5-3610ME, i3-3120ME) CPU and QM77 chipset, the power consumption is (45W for i7 and 35W for both i5 & i3), 4.1W for QM77 PCH. PERFECTRON emphasizes on providing exceeding thermal design, with heat pipes and heat sink construct on both component and system levels. Supporting extended operating temperature from -40 up to 70°C, ROC235A is capable of heat transfer in a limited space. This rigorous industrial 1U rack mount fanless system features a black SECC finish and measures 44mm (1.73”) in height. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling. 9 – 24V wide voltage design enables a more flexible power environment. ROC235A meets the demand of multimedia workstation, network server and high-end digital signage.




System main board: Mini ITX INS8335A

1. Rich I/O, Infinite Possibility

ROC235A contains rich indicators including power, HDD and LAN LED in the front side. For easy integration with all sorts of systems, versatile I/O interface can be found on the rear side. It supports three display (HDMI/VGA/DVI), audio Mic-in, Line-out, 1 x COM, 2 x Ethernet LAN and 6 x USB. Onboard 1x PCI or 1 x PCIe and 1 x mPCIe slots push the expansion ability to the utmost.

2. Wide Voltage Design

ROC235A supports 9 to 24V DC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

3. Ultra Slim Size

ROC235A is a compact yet capable industrial grade fanless system. With a black SECC finish and 44mm (1.73”) in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.


Operating Temp.

-40°C to 70°C



Intel® 22nm Ivy Bridge Processor (Mobile) socket(rPGA988)

Intel® Core™ i7-3610QE (4C x 3.3 GHZ), 6M L2 cache (45W)

Intel® Core™ i5-3610ME (2C x 2.7 GHZ), 3M L2 cache (35W)

Intel® Core™ i3-3120ME (2C x 2.4 GHZ), 3M L2 cache (35W)


Intel® Topcliff EG20TIntel® QM77 Express Chipset (Intel® BD82QM77 PCH)

Memory Type

2 x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 16GB

Expansion Slot

2 x PCI by PCIe x 1, from PCH

1 x Mini PCIe for GEN2

Storage Device

2 x 2.5" SATA HDD/SSD (Easy Swap 2.5" HDD cage)

Supports RAID 0,1

Front I/O

Power Button


Power LED





2 x USB 2.0



Rear I/O


1 x 15-pin VGA connector (female)


1 x 25-pin DVI-D connector (female)


1 x 19-pin HDMI A Type connector (female)


Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)


Mic-in, Line-out


1 x RS232/422/485

Serial Signals


RS422: TX-, RX+, TX+, RX-, GND,



4 x USB 3.0


1 ( Terminal Block)

OS support list


Windows 7 x32/ x64Windows 8.1 x32/ x64Windows 10 x32/ x64


Open SUSE 12.2Ubuntu 12.04

Mechanical and Environment

Power Requirement

9V to 24V DC-in


440 x 44 x 380 mm (17.32" x 1.73" x 14.96")

Operating Temp.

-40°C to 70°C (ambient with air flow)

Storage Temp.

-20°C to 80°C

Relative Humidity

10% to 90%, non-condensing




Test Result



Test Configuration

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in ROC235A for one hour, from +50 to +85°C.




Effective cooling solution for maximum heat dissipation:

What composes of a perfect thermal solution? With ROCS235A, it’s all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. Honeycomb dissipating vents are constructed on the top and the sides to increase the dissipating area. The honeycomb cells can achieve faster heat dissipation without occupying much space. Two heat spreaders and two heat sinks are installed to create a magnificent ventilating structure. Six heat pipes are implemented to conduct the heat to the thermal modules on the two sides of the system. This phenomenal combination can bring out the best dissipating effect.


Honeycomb Dissipating Vents
The honeycomb vents are pre-drilled in rigid aluminum frames to fasten thermal convection and the airflow that will astonishingly enhances ventilation. The enclosure features large, open honeycomb vents on the top, sides, front and back instead of fan solution that allows natural convection cooling that gather dust easily. This heat dissipating design can dispel heat quickly through the honeycomb cells without occupying much space. The unique design enables greater airflow through the entire area of the honeycomb surface. The metalized polymeric honeycomb also brings up excellent rigidity and pressure resistance.


Passive Heat Spreader
Heat spreader is known for improving the distribution of heat. Our tailor-made heat spreader is made with precision and consideration to every detail.

 •It contains % of aluminum, the height is mm and it weighs g.

 •Excellent performance in heat absorption


Dual Sided High Efficiency Thermal Modules
Dual Sided Thermal Modules can transmit the heat transferred by the heat pipes. Fen shaped design helps to emit the heat to the surrounding air, then release through the honeycomb dissipating vents on the front, back, and the sides.


Six Copper Heat Pipes

Six heat pipes are installed to ensure 100% tight integration for superior heat dissipation. Copper heat pipes transfer heat from the heat sources (e.g. CPU, chipset) to the thermal modules on the sides. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

 •8.0 mm diameter heat pipe, 99.9% purity of copper

 •High heat conductivity coefficient up to 5000!


Aluminum Heat Sink

 Heat sink is known for its ability to improve the distribution of heat. Our tailor-made heat sink is made with aluminum. It can dissipate the heat in the quickest fashion.

 •It contains 96% of aluminum, 48mm in height and weighs 103.5g.

 • Consumes shorter heat dissipating time owing to lower metal density

Better performance in heat dissipation



INS8335A is a Mini-ITX form factor industrial motherboard, powered by Intel® Ivy Bridge 22nm processor and QM77 chipset. Processor i7-3610QE plus Intel® QM77 chipset consumes only 45W and 4.1W individually. It supports four-core that can turbo up to eight-core. Extreme computing power and reliability are guaranteed by this powerful combination. Clock speed can boost from 2.3 GHz to 3.3 GHz. Turbo Boost – Full speed operation from 2.3GHz up to 3.3GHz