THOR100S-X11
1U Half Core i7 Fanless Military Server
- Ultra Short Depth 200mm 1U Half Rugged Computer
- Intel® 11th Tiger Lake (U) i7-1185G7E
- Up to DDR4-32GB
- 1x SATA III SSD up to 2TB
- Anti-Vibration up to 10 Grms, Shock 75G
- IP65 Classified
- MIL-STD-461, DC-DC 18V~36V
- Extended operating temperature: -40°C to +70°C
- Size : 220 x 200 x 44 mm (WxDxH)
- Technical Profile
- Specifications
- Order Information
- CPU
THOR100S-X11 is powered by the robust Intel 11th generation Tiger Lake-UP3 i7-1185G7E processor seamlessly integrated onto the motherboard. This compact and fanless rugged system boasts exceptional performance, featuring a quad-core processor with a clock speed of 4.4GHz. Noteworthy is its low power consumption, ranging from 12W to a maximum of 28W.
Emphasizing its rugged design and advanced functionality, the THOR100S-X11 is equipped with a MIL-STD Amphenol type D38999 mini DP connector, ensuring durability in the face of challenging environments. The system's full IP65 protection enables it to withstand harsh conditions with ease.
Designed to operate in extreme temperatures, the THOR100S-X11 supports an extended range from -40 to 70°C. Additionally, its MIL-STD-461 power adheres to a wide input range of 18V to 36V DC, safeguarding the system against voltage surges and enhancing the reliability of critical components. In essence, the THOR100S-X11 stands as a resilient and high-performance solution for demanding applications.
- Robust Product Design Ready For Military Application
System |
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|---|---|
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CPU |
Intel® Core™ i7-1185G7E Processor (4 Core/ 8 Threads, 12M Cache up to 4.40 GHz), 15W/28W |
|
Memory Type |
DDR4 3200MHz / 1x 260-pin SO-DIMM/Max.32GB (Non-ECC) |
|
Expansion Slot |
1x M.2 2230 E-key (Wifi & BT, PCIe/USB) 1x M.2 2242/2260/2280/3042/3052 B-key (Storage/5G/LTE, USB2.0/PCIe x 1/SATAIII) |
Display |
|
|
Chipset |
Intel® Iris Xe Graphics |
|
Mini DP |
Up to 5120 x 3200 @60Hz |
Storage |
|
|
SDD |
1x SATA III SDD - Up to 2TB Capacity |
Ethernet |
|
|
Chipset |
Intel® I219LM Giga LAN+I225LM 2.5G |
Front I/O |
|
|
X1 |
Mini DP with D38999 connector |
|
X2 |
LAN with M12 connector |
|
X3 |
LAN with M12 connector |
|
X4 |
2x USB2.0 + 1x RS232 with M12 connector |
|
X5 |
DC-IN with D38999 connector |
|
Button |
Water Resistive Power Button with dual-color LED Backlight |
Rear I/O |
|
|
Gound Screw |
1 |
Power Requirement |
|
|
Power Input |
18V~36V DC-IN |
|
Power Type |
AT/ATX Mode Select by Jumper |
Power Requirement, Operation System |
|
|
Applications |
Military Platforms Requiring Compliance to MIL-STD-810 |
|
Operating System |
Windows® 11 64-bit, Linux(Support by request) |
Physical |
|
|
Dimension |
220 x 200 x 44 mm |
|
Weight |
2 kg |
|
Chassis |
-40°C to 70°C (ambient with air flow) |
|
Storage Temp. |
-40°C to 85°C |
|
Relative Humidity |
5% to 95%, non-condensing |
|
Ingress Protection |
IP65 |
Environmental |
|
|
EMC |
MIL-STD-461 : CE102 basic curve, 10kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC |
|
Reliability |
No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001/2000 Certified Quality Program. |
|
EMC |
CE compliant |
|
Green Product |
RoHS, WEEE compliance |
|
Operating Temp. |
-40 to 70°C (ambient with air flow) |
|
Storage Temp. |
-40 to 85°C |
|
Relative Humidity |
5% to 95%, non-condensing. |
The THOR100S-X11 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
