SCH3X2-DC
IEC-61850-3 ,IEEE-1613 Micro-Grid Fanless Computer, with Intel® Core™ 13/12th Gen. i9/i7/i5/i3 Processors,expansion 2 x PCIe Gen4 x 8, DC-IN 16~31V, operating Temperature -20°C to 60°C
- Intel® 13th/12th Gen Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 up to TDP 65W
- Up to 64G DDR4 SO-DIMM 3200 MHz
- 2 x DP, 2 x LAN, 2 x USB
- 2x 2.5”Easy swap SSD Tray
- 2 x PCIe Gen4 x 8 slot
- DC-IN 16~31V
- Operation Temp.-20°C to 60°C
- Technical Profile
- Specifications
- Order Information
- Certification
- Introduction
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Micro-Grid are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.
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As a leading company specialized in energy related application, 7StarLake’s experienced team designed an extremely reliable Gateway system SCH3X2-DC/RDC. Powered by Intel 12th/13th Gen. Core i9/i7/i5/i3 processor. SCH3X2-DC/RDC owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 2 x LAN portt. SCH3X2-DC/RDC is an undoubtedly best choice for Micro-Grid application in Substation.
- Key Features
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(1)Power Redundancy
The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.
(3)Rich communication Interface
In advantage of SCH3X2DC-RDC diverse I/O, 2 x LAN(RJ45), 6 x USB, 2 x DP, the SCH3X2-DC/RDC system can satisfy all our clients.
(5)IEC-61850-3
The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED)
(2)IEEE-1613
The widespread use of multifunctional intelligent electronic devices with advanced communications capabilities has resulted in a new trend in substation automation systems. The intelligent electronic devices exchange messages over the substation local area network. Detail environment and testing requirements for communications networking devices in electric power substations.
(4)Extreme Temperature
Copper heat spreader, pure copper heat pipe and aluminum heat sink, with all these benefits of fanless design. To ensure high reliability and stability while SCH3X2-DC/RDC working under wide range temperature from -20°C up to +60°C. And, with SCH3X2-DC/RDC special industrial extended range of temperature layout, it can also reduce the potential computer glitches caused by hardware incompatibility and losses of connectivity caused by shock and vibration.
- Why IEC-61850 Is Necessary
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Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).
- Apperance
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- Dimension
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| System | |
|---|---|
| CPU | 13th / 12th Gen Intel®Raptor Lake-S / Alder Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor up to TDP 65W |
| Memory Capacity | Up to 64G DDR4 SO-DIMM 3200MHz |
| Chipset | Q670 |
| Display | |
| GPU | Intel®UHD Graphics |
| Display Port | DisplayPort 1.4, DP++ Max resolution up to 4K( 4096 x 2304@60Hz) |
| 2nd Display Port | DisplayPort 1.4, DP++ Max resolution up to 4K( 4096 x 2304@60Hz) |
| Expansion | |
| PCIe Slot | 2 x PCIe Gen 4 x 8 Slot |
| M.2 | 1 x M.2 2280 M-Key (PCIe Gen3 x 4, SATAIII) |
| Storage | |
| SATA | Up to 4TB SATAIII |
| M.2 | Up to 2TB NVMe & SATAIII |
| Ethernet | |
| Ethernet |
Intel®I219-LM Giga LAN |
| Front I/O | |
| Power Button | 1 x Power Button |
| Indicator | 1 x HDD backlight / 1 x Power backlight |
| USB3.0 | 2 x USB3.0 |
| Rear I/O | |
| Power Input |
1 x 4P Terminal Block 9~36V DC-IN (2 x 4P Terminal Block 9~36V DC-IN with Redundant) |
| LAN | 2 x 1GbE RJ45 |
| USB3.2 | 2 x USB3.2 |
| USB2.0 | 2 x USB2.0 |
| Display Port | 2 x DP |
| Storage | 2 x 2.5" Swap SSD Tray |
| Power Requirement | |
| Power Input | DC-IN 16~31V |
| OS support list | |
| OS | Window®11 64 bit, / Window®10 IoT LTSC 64 bit (LTSC 2021) / Ubuntu 22.04 / Linux (support by request) |
| Mechanical and Environment | |
| Dimension | 220 x 315 x 167 mm (W x D x H) |
| Operating Temp | -20°C to 60°C |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
| System Design | Fanless |
| Certification | |
| IEC-61850-3 / IEEE-1613 / UL 62368-1 / EN60945 / CE/FCC |
