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SCH300

SCH300_IEC61850-3 IEEE-1613 Cube Fanless Computer for EcoStruxure_01
SCH300_IEC61850-3 IEEE-1613 Cube Fanless Computer for EcoStruxure_02

IEC-61850-3 , IEEE-1613 Substation Fanless Computer, with Intel® Core™ 9th Gen. Coffeelake-R i7-9700TE Processor, Optional for 10 x PoE Ports, 8 x COM Ports (RS232/422/485) ,Operating Temperature -20°C to 60°C

  • Intel® Core™ i7-9700TE 
  • 2 x SO-DIMM up to 64GB DDR4-2666MHz
  • 2 x 2.5”Easy swap SSD Tray
  • 4 x PoE ( Up to 10 PoE for Optional)
  • 2 x RJ45 LAN or M12 ( 10 RJ 45 LAN for Optional)
  • 4 x USB 3.0, 2 x USB 2.0 ,1 x  DP, 1 x DVI
  • 6 x COM RS232/422/485 ( 10 COM for Optional)
  • 8-bit Isolated Digital I/O (4 x DI, 4 x DO),
  • HSR/PRP Dual LAN  Card for Optional
  • 9V-48V DC-Input
  • -20°C to 60°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • Certification
  • GPU

Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.

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As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH300. Powered by Intel 9th Gen. Core i7-9700TE processor, SCH300 owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 10 x LAN port and 2 x COM (up to 16 DIO by request), SCH300 is an undoubtedly best choice for Gateway application in Substation.

 

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(1)Security Redundancy

Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.

 

(2)Network Redundancy

PRP/HSR network is an efficient and cost effective solution to construct a seamless/bumpless communication infrastructure.

 

 

(3)Rich communication Interface

In advantage of SCH300’s diverse I/O, 6 x COM (All support RS232/422/485), 8 x USB, 4 x POE, 2 x LAN, the SCH300 system can meet all clients’ communication requirement.

 

(4)IEC-61850-3

IEC 61850 defines the communication protocols for intelligent electronic devices at electric substations. IEC-61850-3 defines the complete testing requirement for the equipment which conforms to the standard.

 

 

(5)Comprehensive Extension Module

No matter POE or LAN, M12 or RJ45 port, as well as full function RS232/422/485 COM port, SCH300 offers user with variety of options, which can meet all industrial/ energy critical needs.

 

(6)IEEE-1613

Detail environment and testing requirements for communications networking devices in electric power substations.

 

(7)Extreme Operating Temperature

Ensure high reliability and stability while operating under a harsh environment such as temperature from -40°C up to 60°C

 

(8)Ultra Wide Voltage Support

9V-48V, a very wide range voltage of DC-input capability, allows users to adopt all kinds of working site and applications scenario.

 

 

Equipped with Rugged M12 PoE Connectors

 

To support optimal connectivity between the connector and the cable each combination has been matched, M12 PoE Connectors are available for SCH300. Even in extremely rough railway environments, M12 rugged connectors help providing a safe signal transfer. It’s characterized by a reliable 360 degree shielded solution, crimp flange and compact outer dimension, offering a torsion and vibration proof cable strain relief. This reduces cable breakage and makes the system tamper proof.

 

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Why IEC-61850 Is Necessary

Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).

Substation Main Features
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Operating Temp.
 
-40°C  to 60°C 
System
 
CPU Intel® Core™ i7-9700TE
Memory Type 2 x SO-DIMM up to 64GB DDR4-2666MHz
Expansion Slot 2 x IO Expansion Slots
1 x MXM 3.1 Slot
Storage Device 2 x 2.5”Easy swap SSD Tray
Front I/O
 
Power Input DC 9V~48V
USB 4 x USB3.0, 2 x USB2.0
Display 1 x 20Pin DisplayPort connector (Female), resolution up to 4096x2160@60Hz
Ethernet 2 x RJ45 LAN or M12 (6 or 10 RJ45 LAN for Optional)
USB 2 x USB 2.0
DVI 1 x DVI
COM 6 x COM RS232/422/485 (2 or 10 COM for Optional)
DIO 8-bit Isolated Digital I/O (4 x DI, 4 x DO
TPM TPM module onboard
Optional
 
HSR/PRP HSR/PRP Dual LAN Card 
COM 10 COM Ports  Card
PoE 4x PoE  or 4x  RJ45 LAN
PoE 4x PoE  or 4x M12 LAN
OS support list
 
Windows Windows 10 64Bit
Linux Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2
Mechanical and Environment
Power Requirement DC 9V-48V
Dimension 170 x 264 x 250 mm ( W x D x H )
Operating Temp. -20°C to 60°C
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Certification CE, FCC, MIL-STD 810G Compliance
System Design  Fanless
Mounting Rackmount Cube
Test Standard
MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)

Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6 Shock-Procedure I Operating (Mechanical Shock)

Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)

Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

EMC CE, FCC compliant
Green Product RoHS, WEEE compliance
Ordering Information  
SCH300 Cube Fanless Computer for EcoStruxure Computer with Intel. 9th Core i7-9700TE Processor, 2 x RJ45 LAN , RAID 0/1 support, TPM onboard, HSR/PRP for optional,  8 x COM Ports for optional, Wide range 9V-48V DC-in, Operating Temperature -20°C to 60°C
SCH300-PO Cube Fanless Computer for EcoStruxure Computer with Intel. 9th Core i7-9700TE Processor, 4 x PoE , 2 x RJ45 , RAID 0/1 support, TPM onboard, HSR/PRP for optional,  8 x COM Ports for optional, Wide range 9V-48V DC-in, Operating Temperature -20°C to 60°C

Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)

Thermal Point \ Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

   

16

58

68

75

91

CPU Die

   

11.8

38.6

71.9

76

81.5

CPU Heat sink

   

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

   

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

   

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

3.15 3.02

3.02

2.68

2.57

2.45

2.41

Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)

Thermal Point \ Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

   

16

77

95

99

100

CPU Die

   

11.8

38.6

71.9

76

81.5

CPU Heat sink

   

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

   

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

   

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

2.83 2.85

2.66

2.97

2.26

2.18

2.19

Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)

Test 50°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100%CPU Loading
with Graphic

50°C with hot air flow

71.4

68.8

100

3.1 GHz

100%CPU Loading
without Graphic

50°C with hot air flow

70.4

73.2

100

3.2 GHz

Test 60°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading
with Graphic

60°C with hot air flow

76.8

81.5

100

2.99 GHz

100% CPU Loading
without Graphic

60°C with hot air flow

75

79.6

100

3.15 GHz

Test 50°C with no air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading
with Graphic

50°C without air flow

78

81.1

100

3.05 GHz

100% CPU Loading
without Graphic

50°C without air flow

77

81.1

100

3.06 GHz

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