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SCHX4

SCHX4_IEC61850-3 Fanless Rackmount Server for EcoStruxure_02
SCHX4_IEC61850-3 Fanless Rackmount Server for EcoStruxure_02
SCHX4_IEC61850-3 Fanless Rackmount Server for EcoStruxure_02
SCHX4_IEC61850-3 Fanless Rackmount Server for EcoStruxure_02
SCHX4_IEC61850-3 Fanless Rackmount Server for EcoStruxure_02

Micro-Grid Computer with Intel 10th Gen (Cometlake-S) i9-10900TE processor, Extended range of Temperature Support from -20°C to 60°C

  • 10th Generation Intel® Core™ i9-10900TE Cometlake-S Processor
  • DDR4- Up to 64GB
  • 2x SSD – RAID 0/1
  • FTDI Security on Board
  • Multi Display with DisplayPort, HDMI
  • 12V DC-IN
  • 90V~260V AC/DC or 48V DC Redundant PSU for optional
  • HSR/ PRP Ethernet board for Optional
  • Technical Profile
  • Specifications
  • CPU Performance
A. Introduction
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A Microgrid is a small scale, a type of local electric subsystem that combines power from distributed energy generation sources, connected to the general grid at a single point. A Microgrid is a self-contained power system that has the ability to locally generate, distribute, and store energy. It also is a localised energy grid, which is generally linked to the main grid but can disconnect automatically and function as its own independent grid when necessary. This connection also can be acted as a switch that makes it possible to disconnect a Microgrid from the public grid (should anything happen to the main grid such as a blackout.) and operate it temporarily in island mode.

A Microgrid can be powered by distributed generators, batteries, and/or renewable resources like solar panels. Depending on how its requirements are managed, a Microgrid might run indefinitely.

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How does Micro-Grid work?

Microgrid is including three essential sections:

Local energy (such as photovoltaic panels, wind turbines, heat pumps, biomass plants, hydroelectric turbines, etc.) and an additional back-up supply of energy (power generators).  Storage system: batteries, a supply of water for pumped-storage hydroelectricity. Smart management system to ensure the continuous balance between electricity generation and demand.

A fully functioning Microgrid computer system is important for ensuring all processes work correctly and that energy is always being distributed in an efficient manner. 7Starlake provides state-of-the-art solutions for substation automation and Micro-Grid applications for both public utilities and enterprises. Our rich experience in this industry, coupled with our innovative work on the latest technologies, enables us to develop market-specific solutions for computing and communication applications in this domain.

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B. Architecture
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Grid Connected:

The microgrid operates in parallel with the grid, making your community more sustainable and reducing your energy consumption from the grid.

Grid Islanded:

In this mode, the microgrid will power all the critical loads in the community on the utility distribution network when there is no grid power. All of the facilities will stay powered during these extreme events.

Grid Connected:

The microgrid operates in parallel with grid and has the ability to import and export to the grid in response to appropriate price signals. This configuration requires sophisticated controls, testing, and integration to manage interaction with grid.

Grid Islanded:

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C. Main feature
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7STARLAKE's Microgrid system can provide an optimized IEC 61850 PRP/HSR architecture which integreted scalable for easy modification of functionalities and extension of the substation. PRP/HSR network will require an efficient and cost effective solution in order to construct a seamless/bumpless communication infrastructure to ensure maximum system availability. Moreover, the system have a RAID function support an assortment of hard drives connected and set up in ways to help protect or speed up the performance of a computer's disk storage. Thanks to the integration FDTI and TPM module, Operating systems can require an authentication (involving a password or other means) to protect keys, data or systems. Finally, the redundant power supplies can provide two power modules in one power supply for continual monitoring for the most reliable power solution for non-stop applications.

D. Drawing
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Operating Temp.
 
-20°C ~ +60°C ( ambient with air flow )
System
 
Model SCH-X4
CPU Intel® 10th Gen Core™ i9-10900TE (Cometlake-S) Processors, 2 x Dual Channel DDR4 2400/2600 MHz, 260-pin SODIMM,AMI® UEFI BIOS CODE
Chipset Q470
Memory Up to 64GB DDR4 
Display
 
GPU Intel® UHD Graphics
Display Port DisplauPort 1.4, DP++ Max resolution up to 4096x2160@60Hz
HDMI HDMI 2.0a, Max resolution up to 4096x2160@60Hz
Storage
 
Storage Device 1 x PCIe x 16 (Gen3, Support riser card x8/x8, x8/x4/x4 )
1 x M.2 (Key E, 2230) with PCIe x1 and shared USB 2.0 for Wireless
1 x M.2 (Key E, 3042) with shared USB 2.0 and SIM for 4G
1 x M.2 (Key E, 2280) with PCIE x 4 and SATA3 for SSD
1 x SIM socket connected to M.2 key B
Ethernet
 
2 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 ,10/100/1000/2500 Mbps)
Front I/O
 
DisplayPort 2 x DP 1.4
HDMI 1 x HDMI 2.0a
Ethernet 1 x 1 Gigabit Ethernet LAN, 1 x 2.5 Gigabit Ethernet LAN
USB Port 4 x USB3.2 Gen2 standard-A connectors
Serial Port 2 x COM (RS-232/422/485)
Audio Port 1 x Line-Out, 1 x MIC-In connector
DC-IN 4P Rugged Terminal connector
Applications, Operating System
 
Applications Commercial and Military Platforms Requiring Compliance to MIL-STD-810G
Embedded Computing, Process Control, Intelligent Automation and manufacturing
applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and
EMI Conditions.
Used in all aspects of the military.
Operating System Windows 10 64bit
Ubuntu16.04, Ubuntu18.04, Fedora 28
Physical
 
Dimension (W x D x H) 362 x 250 x 70 mm
Weight TBD
Chassis Aluminum Alloy, Corrosion Resistant.
Finish Anodic aluminum oxide (Color Iron gray)
Cooling Natural Passive Convection/Conduction. No Moving Parts
Connectors DC-IN : PHOENIX CONTACT 1776715 RJ45 Ethernet :
RTB-19GB9J1A
COM: FEN YING SM10-09P
HDMI + DP : JKCR Display and HDMI Female
Ingress Protection Dust Proof (Similar to IP50)
Environmental
 
MIL-STD-810G Test Method 507.5, Procedure II (Temperature ® Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 ® 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 ® 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Operating Temperature -20°C to 60°C (ambient with 0.7m/s airflow)
Storage Temperature -40°C to 85°C
EMC CE and FCC compliance

Intel® Core™ i7-10700TE/i9-10900TE Processor 

Thermal Point \ Testing Temp.
-20°C
0°C
+25°C
+40°C
+50°C
+55°C
+60°C

CPU Frequency (GHz)

3.69

3.69

3.69

3.69

1.99~3.69

1.99~3.69

1.99~3.69

CPU Heatsink

19.2

20.1

60

66.4

71.1

75

81.9

CPU Die

24.5

25.6

70

71.7

75.5

78

77.3

CPU T-J (℃)

39℃

42℃

89℃

90℃

78~98℃

80~99℃

83~100℃

Test Configuration

Device

Configuration

CPU Type

Intel® Core™ i7-10700TE Processor 2.0 GHz

PCH

Intel Q470E

Memory

Innodisk 8GB SOD DDR4 2666 X2

SATA port 1

InnDisk 3MG2-P SSD 64G

DP

Dell U2312

LAN1 ~ LAN2

LAN (Loopback)

USB1~USB4

1A cement resistor

COM Com port loopback

Test Software

Burnin test v9.0 XTU CPU STRESS,FU MARK

Chamber

KSON THS-b4t-150
Chipeng SMO-3

Test Equipment FSP060-DBAE1、PROVA 11_AC/DC mA clamp meter、Agilent U1252B