INS8367A

Mini-ITX Form Factor Intel® 12th Gen. Core™ i9/i7/i5/i3 processors

Support Intel® 12th Core™ i9/ i7/i5/i3 Alder Lake-S LGA1700 35W/65W Socket Processor
Intel® Q670/H610 Chipset
2 x DDR5 SO-DIMM up to 64GB
6 x USB3.1(Q670) / 4 x USB3.0(H610) ; 5 x USB2.0(Q670/H610)
1 x HDMI ; 1 x DP ; 1 x LVDS(eDP optional)
1 x M.2 M-Key 2242/2280, 1 x M.2 E-Key 2230, 1 x M.2 B-Key 3042, 1 x mPCIe Full size, 1 x PCIe x4
2 x SATAIII
1 x 2.5GbE +1 x GbE LAN
DC-IN 12V(Optional : 19V)
Operating Temperature : ET : -20°C ~ 70°C ; UT : -40°C ~ 85°C

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Technical Profile
Specifications

Introduction

INS8367A is a powerful rugged Mini-ITX solution driven by 12th Gen Intel® Alder Lake-S LGA1700 Socket Processor The larger LGA 1700 socket takes over LGA 1200 socket; the well-known improvements are the DDR5 and PCIe 5.0 support, but the processor also support DDR4. The new design is divided into performance cores, the so-called P- cores, and energy efficient cores, the E-cores, it allows handling 24 threads. The CPU is single and scalable SoC architecture on Intel 7 process, and 19% performance lift with new performance-core.

It is Compatible with 1 x M.2 2230 E-Key ( Wifi & BT , (PCIe / USB)), and 1 x M.2 2242/2260/2280/3042/3052 B key (Storage/5G/LTE, (USB2.0/*PCIex1/SATAIII)). Four independent displays can be driven up to 4K resolutions via DisplayPort, HDMI, LVDS, and optional eDP. Besides, INS8367A got rich I/O ports, includes 4 x USB3.1, 4 x USB3.0, and 2 x LAN, complete and flexible expansion possibility for easy system integration.

An extended operating temperature of -40°C ~ 85°C, to ensure ultimate durability, utmost resistance to shock & vibration. INS8367A is truly a rugged Mini-ITX board ideal for Energy/ Utility/ High performance application needs. With various extensive ability and strong computing power, which can be utilized in applications such as large size KIOSK, facial identification, and gaming industry.

Block Diagram

System
CPU	12th Gen Intel® Alder Lake LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor, TDP 35/65W
Memory type	DDR5 4800 MHz / 2 x 262-pin SO-DIMM / Max. 64GB (Non-ECC) Horizontal
Chipset	Intel® H610 / Q670
I/O Chipset	Nuvoton NCT6126D
TPM	TPM Header
H / W Monitor	Temperature Monitor, Voltage Monitor, Fan Monitor
Watchdog	1-255 sec. or 1-255 min. software programmable and can be generate system reset
Smart Fan Control	CPU FAN / System FAN
BIOS	AMI BIOS
Expansion Slot
M.2	1 x M.2 2230 E-Key ( Wifi & BT , (PCIe / USB)) 1 x M.2 2242/2260/2280/3042/3052 B-Key (Storage/5G/LTE, (USB2.0/*PCIex1/SATAIII))
Display
Chipset	Intel® UHD Graphics 770
HDMI	Up to 4K (4096 x 2160) @30 Hz
Display Port	Up to 4K (4096 x 2304) @60 Hz
LVDS	Up to 1920 x 1200 @60 Hz
eDP (Option)	Up to 4K (4096 x 2304) @60 Hz
Ethernet
Chipset	Intel® I219-LM GbE LAN + Intel® I225V 2.5 GbE LAN
Audio
Codec	Realtek® ALC888
Rear IO
USB	4 x USB3.1(Q670) ; 4 x USB3.0(H610)
Display port	1 x DP ; 1 x HDMI
LAN	2(1 x GbE ; 1 x 2.5GbE)
AUDIO	1 x MIC-IN ; 1 x LINE-OUT
Internal I/O
SATAIII	2
USB3.1	2(Q670 only)
USB2.0	5(Q670/H610)
Display I/O	1 x LVDS(optional eDP SKU) 1 x Backlight connector
Serial	2 (1 x Support RS-232/422/485)
FAN	1 x 4-pin CPU Fan Connector / 1 x 4-pin System Fan Header
Power	1 x 12V DC IN Jack( Colay 19V) 1 x ATX 4pin (AT/ATX mode by jumper setting)
Others	1 x Front Audio Header (Mic-in / Line-out), 1 x CMOS Jumper, 1 x panel power select header,1 x SATA power, 1 x FIO header, 1 x intrusion switch header, 1 x DMIC header, 1x buzzer header 1 x GPIO header
Mechanical and Environmental
Form Factor	Mini ITX
Power Type	12V DC-IN(Optional : 19V)
Dimension	170mm x 170mm
Operating Temperature	ET : -20℃ ~ 70℃ UT : -40℃ ~ 85℃
Storage Temperature	-40℃ ~ 85℃
Relative humidity	10% to 95%, non-condensing
Standard Compliance
Standard Compliance	CE/FCC
OS
OS Support	Windows® 10 64-bit Linux(Support by request)