INS8367A
Mini-ITX Form Factor Intel® 12th Gen. Core™ i9/i7/i5/i3 processors
- Support Intel® 12th Core™ i9/ i7/i5/i3 Alder Lake-S LGA1700 35W/65W Socket Processor
- Intel® Q670/H610 Chipset
- 2 x DDR5 SO-DIMM up to 64GB
- 6 x USB3.1(Q670) / 4 x USB3.0(H610) ; 5 x USB2.0(Q670/H610)
- 1 x HDMI ; 1 x DP ; 1 x LVDS(eDP optional)
- 1 x M.2 M-Key 2242/2280, 1 x M.2 E-Key 2230, 1 x M.2 B-Key 3042, 1 x mPCIe Full size, 1 x PCIe x4
- 2 x SATAIII
- 1 x 2.5GbE +1 x GbE LAN
- DC-IN 12V(Optional : 19V)
- Operating Temperature : ET : -20°C ~ 70°C ; UT : -40°C ~ 85°C
- Technical Profile
- Specifications
- Introduction
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INS8367A is a powerful rugged Mini-ITX solution driven by 12th Gen Intel® Alder Lake-S LGA1700 Socket Processor The larger LGA 1700 socket takes over LGA 1200 socket; the well-known improvements are the DDR5 and PCIe 5.0 support, but the processor also support DDR4. The new design is divided into performance cores, the so-called P- cores, and energy efficient cores, the E-cores, it allows handling 24 threads. The CPU is single and scalable SoC architecture on Intel 7 process, and 19% performance lift with new performance-core.
It is Compatible with 1 x M.2 2230 E-Key ( Wifi & BT , (PCIe / USB)), and 1 x M.2 2242/2260/2280/3042/3052 B key (Storage/5G/LTE, (USB2.0/*PCIex1/SATAIII)). Four independent displays can be driven up to 4K resolutions via DisplayPort, HDMI, LVDS, and optional eDP. Besides, INS8367A got rich I/O ports, includes 4 x USB3.1, 4 x USB3.0, and 2 x LAN, complete and flexible expansion possibility for easy system integration.
An extended operating temperature of -40°C ~ 85°C, to ensure ultimate durability, utmost resistance to shock & vibration. INS8367A is truly a rugged Mini-ITX board ideal for Energy/ Utility/ High performance application needs. With various extensive ability and strong computing power, which can be utilized in applications such as large size KIOSK, facial identification, and gaming industry.
- Block Diagram
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