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INS8367A

Mini-ITX Form Factor Intel® 12th Gen. Core™ i9/i7/i5/i3 processors

  • Support Intel® 12th Core™ i9/ i7/i5/i3 Alder Lake-S LGA1700 35W/65W Socket Processor
  • Intel® Q670/H610 Chipset
  • 2 x DDR5 SO-DIMM up to 64GB
  • 6 x USB3.1(Q670) / 4 x USB3.0(H610) ; 5 x USB2.0(Q670/H610)
  • 1 x HDMI ; 1 x DP ; 1 x LVDS(eDP optional)
  • 1 x M.2 M-Key 2242/2280, 1 x M.2 E-Key 2230, 1 x M.2 B-Key 3042, 1 x mPCIe Full size, 1 x PCIe x4
  • 2 x SATAIII
  • 1 x 2.5GbE +1 x GbE LAN
  • DC-IN 12V(Optional : 19V)
  • Operating Temperature : ET : -20°C ~ 70°C ; UT : -40°C ~ 85°C
  • Technical Profile
  • Specifications
Introduction

INS8367A is a powerful rugged Mini-ITX solution driven by 12th Gen Intel® Alder Lake-S LGA1700 Socket Processor The larger LGA 1700 socket takes over LGA 1200 socket; the well-known improvements are the DDR5 and PCIe 5.0 support, but the processor also support DDR4. The new design is divided into performance cores, the so-called P- cores, and energy efficient cores, the E-cores​​​​​, it allows handling 24 threads. The CPU is single and scalable SoC architecture on Intel 7 process, and 19% performance lift with new performance-core.

Intel

 

It is Compatible with 1 x M.2 2230 E-Key ( Wifi & BT , (PCIe / USB)), and 1 x M.2 2242/2260/2280/3042/3052 B key (Storage/5G/LTE, (USB2.0/*PCIex1/SATAIII)).  Four independent displays can be driven up to 4K resolutions via DisplayPort, HDMI, LVDS, and optional eDP. Besides, INS8367A got rich I/O ports, includes 4 x USB3.1, 4 x USB3.0, and 2 x LAN, complete and flexible expansion possibility for easy system integration.

 

An extended operating temperature of -40°C ~ 85°C, to ensure ultimate durability, utmost resistance to shock & vibration. INS8367A is truly a rugged Mini-ITX board ideal for Energy/ Utility/ High performance application needs. With various extensive ability and strong computing power, which can be utilized in applications such as large size KIOSK, facial identification, and gaming industry.

Block Diagram
INS8367A Block diagram

INS8367A

System

CPU

12th Gen Intel® Alder Lake LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor, TDP 35/65W

Memory type

DDR5 4800 MHz / 2 x 262-pin SO-DIMM / Max. 64GB (Non-ECC) Horizontal 

Chipset

Intel® H610 / Q670

I/O Chipset

Nuvoton NCT6126D

TPM

TPM Header

H / W Monitor

Temperature Monitor, Voltage Monitor, Fan Monitor

Watchdog

1-255 sec. or 1-255 min. software programmable and can be generate system reset

Smart Fan Control

CPU FAN / System FAN

BIOS

AMI BIOS

Expansion Slot

M.2

1 x M.2 2230 E-Key ( Wifi & BT , (PCIe / USB))

1 x M.2 2242/2260/2280/3042/3052 B-Key (Storage/5G/LTE, (USB2.0/*PCIex1/SATAIII))

Display

Chipset

Intel® UHD Graphics 770

HDMI

Up to 4K (4096 x 2160) @30 Hz

Display Port

Up to 4K (4096 x 2304) @60 Hz

LVDS

Up to 1920 x 1200 @60 Hz

eDP (Option)

Up to 4K (4096 x 2304) @60 Hz

Ethernet

Chipset

Intel® I219-LM GbE LAN + Intel® I225V 2.5 GbE LAN

Audio

Codec

Realtek® ALC888

Rear IO

USB

4 x USB3.1(Q670) ; 4 x USB3.0(H610)

Display port

1 x DP ; 1 x HDMI

LAN

2(1 x GbE ; 1 x 2.5GbE)

AUDIO

1 x MIC-IN ; 1 x LINE-OUT

Internal I/O

SATAIII

2

USB3.1

2(Q670 only)

USB2.0

5(Q670/H610)

Display I/O

1 x LVDS(optional eDP SKU)

1 x Backlight connector

Serial

2 (1 x Support RS-232/422/485)

FAN

1 x 4-pin CPU Fan Connector / 1 x 4-pin System Fan Header

Power

1 x 12V DC IN Jack( Colay 19V)

1 x ATX 4pin (AT/ATX mode by jumper setting)

Others

1 x Front Audio Header (Mic-in / Line-out), 1 x CMOS Jumper,

1 x panel power select header,1 x SATA power,

1 x FIO header, 1 x intrusion switch header, 1 x DMIC header, 1x buzzer header

1 x GPIO header

Mechanical and Environmental

Form Factor

Mini ITX

Power Type

12V DC-IN(Optional : 19V)

Dimension

170mm x 170mm

Operating Temperature

ET : -20 ~ 70

UT : -40 ~ 85

Storage Temperature

-40 ~ 85

Relative humidity

10% to 95%, non-condensing

Standard Compliance

Standard Compliance

CE/FCC

OS

OS Support

Windows® 10 64-bit

Linux(Support by request)