INS8365B

INS8365B, Support 8th/ 9th Coffee Lake Intel® Core™ i9/ i7/i5/i3 LGA1151 Socket Processor

Support 8th/ 9th Coffee Lake Intel® Core™ i9/ i7/i5/i3 LGA1151 Socket Processor
Intel® Q370 Chipset
Intel® vPro technology support
2 x DDR4 SO-DIMM up to 64GB
2 x DisplayPort, 1 x HDMI
2 x RJ45 (Intel I219-LM Giga LAN + Intel I210-AT Giga LAN)
4 x USB 3.1 Gen. 2
1 x M.2 M 2280, 1 x M.2 E 2230, 1 x mPCIe Full size, 1 x PCIe X16
DC-in 12V
Operating Temperature: -20°C ~ 70°C ET, -40°C ~ 85°C UT

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Technical Profile
Specifications

Introduction

INS8365B, a powerful rugged Mini-ITX solution driven by Intel® 9th generation Coffee Lake-R CPU, support LGA1151 Socket Processor on TDP of 35W/65W/95W up to Octa cores. Accompanied with Intel® Q370 chipset, the IMB with high computing power is capable of multi-tasking while reducing idle power consumption, and also fulfill variety of utility applications. A wide range power input option offers users opportunity to adopt various application conditions.

Besides, INS8365B got rich I/O ports, complete and flexible expansion possibility for easy system integration. For mission-critical applications, INS8365B take advantage of key components soldered onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration.

INS8365B is truly a rugged IMB ideal for Energy/ Utility/ High performance application needs.

Main Features

DC Input : Main configuration is 12V DC input, and it can extend to 12~24V for wide range option.
Extended Temperature : Operation under -20~+70 degree, -40 degree nature boot up for mission critical applications, and harsh environment.
RICH Expansions : 1 x PCIe X16 slot, 1 x Mini PCIe Full size, 1 x M.2 2260 / 2280 M key, 1 x M.2 2230 E key

Operating Temp.
ET : -20°C to 70°C UT : -40°C to 85°C
System
CPU Type	9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i9-9900T (8core/35W) Core i7-8700K (6core /95W) Core i7-9700TE (8core/35W) Core i5-9500TE (6core /35W)
Chipset	Intel Q370 (Support RAID 0 / 1) support vPro / Intel H310
Memory Type	DDR4 2666MHz, 2 x 260-pin SO-DIMM, Max. 32GB (Non-ECC)
BIOS	AMI BIOS, 256 Mbit SPI
Watchdog	1~255 Steps by Software
Graphics	Intel HD Graphics
Ethernet	Intel I219-LM Giga LAN + Intel I210-AT Giga LAN
Audio	Realtek ALC662
Super I/O	Nuvoton NCT6116D
TPM	TPM Header (option TPM-SPI-NPCT750)
H / W Monitor	Temperature Monitor, Voltage Monitor, Fan Monitor
Form Factor	Mini-ITX: 6.7” x 6.7” (170mm x 170mm)
Expansion Slot
Expansion Slot	1 x PCIe X16 slot 1 x Mini PCIe Full size (SATA, USB, PCIe) 1 x M.2 2260 / 2280 M key (PCIe, SATA) * H310 only supports M.2 SATA SSD 1 x M.2 2230 E key (PCIe, USB 2.0)
Display
HDMI	Up to 4K (4096 x 2160) @30 Hz
DisplayPort	Up to 4K (4096 x 2304) @60 Hz
2nd DisplayPort	Up to 4K (4096 x 2304) @60 Hz (Q370 ONLY)
LVDS	Up to 1920 x 1200 @60 Hz
Rear I/O
Display I/O	1 x HDMI 1.4, 2 x DisplayPort 1.2
Audio I/O	1 x Mic-in ,1 x Line-out
USB	4 x USB 3.1 Gen. 2 (10Gb/S)(Q370) / 4 x USB 3.0 (H310)
LAN	2 x RJ-45
Others	1 x DIN 4-pin DC Jack
Internal I/O
SATA	2 x SATAIII
USB	5 x USB 2.0 (Q370) , 4 x USB 2.0 (H310)
Display I/O	1 x LVDS (Optional eDP SKU available) 1 x Backlight Connector
Audio I/O	1 x Speaker 2W
Serial Port	4 x RS232 (two supports RS232/422/485 select by BIOS)
GPIO	1 x MiAPI Header (Programmable)
Fan	1 x 4-pin CPU Fan Connector, 1 x 4-pin System Fan Connector
Power	1 x ATX 4-pin Power Connector, 1 x AT / ATX Mode Select Jumper
Others	1 x Front Audio Header (Mic-in / Line-out), 1 x CMOS Jumper, 1 x panel power select header, 1 x backlight power select header, 1x buzzer header
Mechanical and Environment
Power Input	DC-in 12V DIN 4-pin connector / ATX 4pin 12V *optional 12V-24V SKU
Operating Temperature	ET : -20°C to 70°C UT : -40°C to 85°C
Storage Temperature	-40°C to 85°C
Operating Humidity	10% ~ 95% R/H, non-condensing
Certification	CE & FCC Class B