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OXY5638B

OXY5638B_Core™ i7-5650U, 12V DC Input, -40°C~85°C_01
OXY5638B_Core™ i7-5650U, 12V DC Input, -40°C~85°C_02
OXY5638B_Core™ i7-5650U, 12V DC Input, -40°C~85°C_03
OXY5638B_Core™ i7-5650U, 12V DC Input, -40°C~85°C_04
OXY5638B_Core™ i7-5650U, 12V DC Input, -40°C~85°C_05
OXY5638B_Core™ i7-5650U, 12V DC Input, -40°C~85°C_06

Intel® 5th Gen. Broadwell ® Core™ i7-5650U processors , XR-DIMM, uSSD 64GB on board , PCIe/104 expansion, Extended Temperature -40°C to 85°C

  • Support Intel® Core™ i7-5650U Processor
  • Intel® Core™ i7-5650U Processor (4M Cache, up to 3.20 GHz) 
  • uSSD 64GB (SATA III)
  • 2 x XR-DIMM up to DDR3L -1600 16GB
  • Expansion :1x PCIe/104 (1 x PCIe_4, 4 x PCIe_1)
  • 2 x Mini PCIe with SIM Card Holder
  • Multi display:2 x DisplayPort ; Dual Channel 24 Bit LVDS
  • Dual LAN Ports (1 x Intel I210-IT & 1 x I218-LM GbE)
  • 4 x COM ports: 3 x RS-232 (pin-header) with 5V/12V selection
  • 1 x RS232/422/485 with 5V/12V selection
  • 6 x USB ports: 2 x USB 3.0, 4 x USB 2.0
  • Extended operating temp. -40°C to 85°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
Introduction

OXY5638B, a powerful rugged EPIC SBC is driven by Intel® Broadwell processor i3-5010U, i5-5350U and i7-5650U soldering onboard. Broadwell processors support outstanding graphics and CPU performance, providing quad cores 3.20GHz clock speed while consuming low power consumption. The powerful combination makes the SBC with high computing power for multi-tasking while reducing idle power consumption. OXY5638B is regarded as a rich-featured board that can be applied to cater various I/O requirements. Mission-critical applications can take the advantages of processors soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5638B is truly a rugged SBC ideal for building rugged tablet, entry-level automation and railway infotainment applications. The Intel Core i7-5650U is an ULV (ultra low voltage) dual-core processor based on the Broadwell architecture, which has been launched in January 2015. In addition to two CPU cores with Hyper-Threading clocked at 2.2 - 3.2 GHz (2 Cores: 3.1 GHz), the chip also integrates an HD Graphics 6000 GPU and a dual-channel LPDDR3-1866/DDR3L-1600 memory controller. The Core i7 is manufactured in a 14 nm process with FinFET transistors.
Compared to the Core i7-5600U, the i7-5650U features a lower CPU base clock, but integrates a somewhat faster GPU.

5638B

 

Design your own system (I/O PIN header)

OXY5638B embraces rich I/O that provides embedded system developers diverse flexibility in I/O configurations to meet different embedded applications. The rich I/O features multiple displays, 2 x DP ports with dual channel 24-bit LVDS. This feature-rich board comes with a variety of I/O, including six RS232, three USB ports, two Gigabit LANs, two SATAII, all these can help system integrators to develop solutions quickly. OXY5638B offers optimal choices for multi-function, such as onboard SIM Card slot for 3.5G connectivity. The versatile expansion compatibility also includes two full-size miniPCIe that could add on additional I/O or additional functionality. And also for reserving the PIN header, OXY5638B supports the customization by fulfill the demands from the clients.

MIL-STD 810G Certificated

PERFECTRON’s Stack Rack series rugged computers –OXY5638B is designed to meet the strict standards of MIL-STD 810G. When it comes to true ruggedness, MIL-STD-810G standard is considered the upmost principle. Originally established by the US government to simulate how materials would hold up to harsh environments, It provides a series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures.

Extended with PCIe/104+ connector for ultimate I/O & features expansion

The StackPC Specification defines new approach to stackable systems design and development. The specification includes all valuable heritages of PCIe/104 standards along with the new features of StackPC connector.

The main competitive distinction of the StackPC connector is the combination of most popular low speed interfaces such as USB, COM, CAN, SPI, LPC and high speed SATA, Gigabit Ethernet and PCI-Express x1, x4 within one stack expansion connector.

technial01

Industrial Standard (EPIC)

EPIC is a new standard that solves the need for an industrial-quality SBC that fits in size between PC/104-Plus and EBX standards. EPIC is endorsed by major SBC companies. It supports both PC/104 and PC/104-Plus expansion to take advantage of the hundreds of I/O modules available worldwide. It also has the flexibility to support high speed, serial buses like PCI Express.

Graphics

The integrated HD Graphics 6000 offers 48 Execution Units (EUs) clocked at 300 - 1000 MHz. Similar to the CPU core, the GPU architecture (Intel Gen 8) has been thoroughly revised for improved performance-per-clock. We expect the HD Graphics 6000 to be significantly faster than the former HD Graphics 5000 (40 EUs), part of the Haswell generation. Nevertheless, demanding games as of 2015 should be playable only in low or medium settings. Broadwell is the first Intel chip to fully support DirectX 11.2 as well as OpenCL 1.3/2.0 and OpenGL 4.3. Video will output natively via DisplayPort 1.2 or HDMI 1.4a. However, the new HDMI 2.0 standard is not officially supported.

 

 

Operating Temp.

 

-40°C to 85°C

 

System

 

CPU Type

Intel® Core™ i3-5010U Processor (3M Cache, 2.10 GHz)

Intel® Core™ i5-5350U Processor (3M Cache, up to 2.90 Intel® Core™ i7-5650U Processor (4M Cache, up to 3.20 GHz)

Memory Type

2 x XR-DIMM up to 16 GB

BIOS

AMI®UEFI BIOS

Watchdog

1-255 sec. or 1-255 min. software programmable, can generate system reset

Display

 

Chipset

Intel® Gen8 Graphic

LVDS

Dual channel 24bit LVDS (eDP LVDS CH7511B)

Display Type

LVDS, DP

Audio

 

Codec

Realtek ALC888S

Ethernet

 

Chipset

1 x Intel I210-IT & 1 x I218-LM GbE

WOL

Yes

Boot from LAN

Yes for PXE

Rear I/O

 

Power Connector

11 (Terminal Block co-lay 4-pin connector with lock)

Internal I/O

 

SATA

2 x SATAIII (6Gb/s, RAID 0/1)

USB

2 (pin header)

USB1.1/2.0

4 (pin header)

COM

3 x RS232 with 5V/12V selection

1 x RS232/422/485 with 5V/12V selection

Ethernet

2 (pin header)

Audio

Line-out, Mic-In, Line-in

SIM card holder

2

DIO

2 (2x5-pin), 8 in / 8 out

LPC

1

LVDS

1 (2 x 15-pin)

DP

2

Mechanical and Environment

 

 Form Factor

EPIC SBC

 Power Type

12V DC-in

 Dimension

180 mm x 115 mm

 Operating Temp.

-40 to 85°C

 Storage Temp.

-40 to 85°C

 Relative Humidity

10% to 90%, non-condensing

TEST STANDARD

 

 MIL-STD-810G

Temperature Shock:

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85 to -40, Three cycle)

 

High Temperature:

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75 non-operating + 72 hours @ 75 operating )

Low Temperature:

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40 non-operating +72 hours @ -40 operating )

CPU Performance

The OXY5638B offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

OXY5638B_CPU_PIC

Test Result

5638

Test Configuration
Test Configuration
Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5638B for one hour, from -40 to +85°C.

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OXY5638B_SSD

Introduction

THOR100-CI is driven by Intel 5th generation Broadwell i7-5650U processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Broadwell processor supports outstanding CPU and graphics performance, providing dual cores 3.2GHz clock speed while consuming low power consumption 9.5W. THOR100-CI highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR100-CI supports extended temperature from -40 to 70°C and wide range 9V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

application01

 

application0

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to Lowering the temperature by dissipating heat into the surrounding air. Aluminum material AL6063, 39 mm height and weighs 3300 g

application03

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Copper heat pipe transfers heat from the heat sources CPU to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid. 8.0 mm diameter heat pipe, 99.9% purity of copper High heat conductivity coefficient up to 5000

application04

Copper Heat spreader

Copper heat spreader directly touches the heat source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure, 99.9% purity of copper

application05

Rugged SBC

Rugged Intel Broadwell SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module.

application06

application07

Amphenol M12 Type

THOR100-CI all applied by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.
 

  • Fieldwireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
  • M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.

 

 

application08

Aluminum Heat Sink

The heat sink is made by heat radiating material, Which is aim to lowering the temperature by dissipating heat into the surrounding air. Aluminum material AL6063, 5 mm height