OXY5741B

9th Gen. Intel^® Xeon^®, Core™ i7 EBX SBC with PCIe/104 Rugged Extreme Temperature -40°C to 85°C

9th / 8th Gen Intel^® Xeon^® / Core™ processor with up to 6 Intel^® Xeon^® E-2276ME / E-2276ML / Core™ i7-9850HE / i7-9850HL / i5-8400H
PCIe/104 stackable bus structure(Type 2)
FPE connector ( 1*PCIe x16 or 2*PCIe x8 or 1*PCIe x8+2*PCIe x4)
4x DDR4-2666MHz SO-DIMM, up to 128GB, ECC for Xeon® SKU
Multi display” Triple simultaneous displays with 48-bit LVDS+DP
1x M.2 2280 M-key, 2x Full size mPCIe, 1x PCIe/104, 1x FPE
Dual GbE, 4x SATA III, 2x RS232/422/485
6x USB3.0, 4x USB2.0
Extended operating temp. -40°C to 85°C

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Introduction: PERFECTRON, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741B. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, PERFECTRON EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

Key Features

9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
EBX SBC Dedicates PCIe/104 Type 2
Dual channel DDR4-2666MHz with up to 128GB *, ECC for Xeon SKU
Three simultaneous displays with 48 bit LVDS + HDMI + DP
USB 3.0, TPM 2.0 and NVMe / PCIe Gen3x4 SSD
Dual GbE, SATA III, RS-232/422/485
M.2 M-Key 2280 and Full size mPCIe(one support SIM card)

What is Small Form Factor (S.F.F)?: Small form factor computer is the crucial component that drives the entire system operation as they can fit into smaller spaces and consume less power. They can be packaged and mounted in diverse ways than larger boards. The reduction of size, weight, and cost (SWaP) has been continuously emphasised as more computer systems demand smaller processor and network connectivity solutions. As a result, application such as automation and transportation which demand more differently stackable ways often employ small form factors architecture.

DDR4 2666 128GB Optimised Performance: Since speed and power matters most in computing performance, OXY5741B is built in 4 x SO-DIMMs up to 128GB to deliver optimisation of the performance. Adding DDR4-128GB not only maximises CPU and computing performance, but also enables more robust and responsive virtual machines and applications. Taking advantage from the cutting edge DRAM technology, OXY5741B EBX XEON SBC can optimise system performance by accelerating the memory capacities of servers.

Ruggedised Open Standard PCIe/104 Facilitate Flexible Expansion: Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedised, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741B employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key 2280, and PCIe 3.0 x 4 NVMe. Additionally, OXY5741B provides 3.0 ports for data redundancy by supporting RAID 0/1.
High Performance and Fast Storage: Today, ruggedised systems or computers are expected to possess speedy and smooth response times. In light of making these systems render high performance, NVMe protocol delivers a high-bandwidth and low-latency user experience. Moreover, via accessing a PCIe bus that supports a huge number of parallel command queues, NVMe can effortlessly access flash storage. This platform incorporates Intel® Xeon E-2276ME with 4 cores. OXY5741B supports up to 128GB of dual-channel DDR4 2400MHz memory and features an M.2 M-Key 2280 slot for NVMe / PCIE Gen3x4 high-speed PCIe SSD storage, thus offering extremely high data speeds for processing. The above features make OXY5741B an outstanding solution for applications that demand high performance in a EBX form factor.

Board Placement

Top placement

Back placement

System
CPU	Intel® Core™ i7-9850HE Processor (6 Cores/12 Threads, 9M Cache, up to 4.40 GHz), 45W Intel® Core i7-9850HL Processor (6 Cores/12 Threads, 9M Cache, up to 4.10 GHz), 25W XEON® E-2276ME Processor (6 Cores/12 Threads, 12M Cache, up to 4.50 GHz), 45W XEON® E-2276ML Processor (6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W Intel® Core™ i5-8400H Processor (6 Cores/12 Threads, 8M Cache, up to 4.20 GHz), 45W
Memory type	4x DDR4 2666MHz 260 Pin SO-DIMM (up to 128GB, Xeon® Sku Support ECC)
Chipset	CM246
BIOS Core	AMI® UEFI BIOS
BIOS Flash	SPI Flash
Super I/O	ITE 8786
TPM	TPM 2.0 (SLB9665)
iAMT	iAMT 12.0
Watchdog	1-255 sec. or 1-255 min. software programmable and can be generate system reset
Display
Display Port	Resolution up to 4096 x 2304 @ 60Hz
Chipset	Intel® UHD Graphics 630
Multi-Display	Triple simultaneous display with LVDS + 2x Mini-DP
LVDS	1* Dual Channel 24-bit LVDS, max resolution up to 1920 x 1080 @60Hz (w/auto-dimming support)
Audio
Codec	ALC888S
Expansion Slot
M.2	1x M.2 (M-key, type:2280, SATA/PCIe 3.0 x4 NVMe)
miniPCIe	2x Full size (USB/PCIe and 1x Micro SIM Card)
PCIe/104	TYPE 2
FPE	1x FPE slot.
Ethernet
Chipset	Intel® I210 & I219LM GbE LAN (10/100/1000 Mbps supported )
WOL	Yes
Boot from LAN	Yes for PXE
Rear I/O
Display Port	2*mini-DIP Display Port Female 20P 90D
Internal I/O header (No Edge I/O Needed)
SATA	4x SATAIII (RAID 0,1,5) , from 2 up to 4 ports
SATA power	4x
LVDS connector	1x (30 pins) or equal ---> W/Auto-dimming supports), Bright light control
LVDS Inverter	1x (10 pins) box header
8 bit GPIO	1x (4in/4out) in a (10 pins) box header
Serial	2x RS232/422/485 (2x 10 pins) box header
SIM card holder	1x (Micro SIM) in mini-PCIe slot
LAN	2x 10/100/1000 Base (20 x 1.0 wire to Board connector)
USB 3.0	4x USB3.0 (2x 20GU 2.0 x 2.0mm box header)
USB2.0	4x USB2.0(2x5 Pins) box header
LPC	1x LPC (10 pins ) box header
Front Panel	1 (2x 5 pins) Power BTN/HDD LED/Reset BTN/PWR LED/Buzzer
Smart Fan	1x CPU Fan --->1x 4 pins for CPU(PWM mode)
Audio	1x MIC-IN / LINE OUT (10 pins) box header
Battery	1x RTC battery holder
Power DC-IN	1x (4 x 2pin) horizontal type
Mechanical and Environmental
Form Factor	EBX
Dimension	146mm x 243mm
Power Type	DC-IN 12V
Power Consumption	180W
Operation Temperature	-40℃ ~ 85℃(ambient with air flow)
Storage Temperature	-40℃ ~ 85℃
Relative humidity	10% to 90%, non-condensing
Standard Compliance
Standard Compliance	CE/FCC
OS
OS Support	Windows® 10 64-bit Linux (Support by request)

Model	Description
OXY5741B-01UT	EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor 7 I7-9850HE(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-02UT	EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor I7-9850HL(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-03UT	EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor E-2276ME(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-04UT	EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor E-2276ML(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-05UT	EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor I5-8400H(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)

Cable kit