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OXY5741A

9th Gen. Intel® Xeon®, Core™ i7 EBX SBC with PCIe/104 Rugged Extreme Temperture -40 to 85°C

  • 9th / 8th Gen Intel® Xeon® / Core™ processor with up to 6 Intel® Xeon® E-2276ME / Xeon® E-2276ML / Core™ i7-9850HE / Core™ i7-9850HL / Core™ i5-8400H
  • PCIe/104 stackable bus structure(Type 2)
  • FPE connector ( 1*PCIe x 16 or 2*PCIe x 8 or 1*PCIe x 8+2*PCIe x 4)
  • 4 x DDR4 SO-DIMM 2666MHz, up to 128GB, ECC for Xeon® SKU
  • Multi display” Triple simultaneous displays with 48-bit LVDS+DP
  • 1 x M.2 2280 M-key, 2 x Full size mPCIe, 1 x PCIe/104, 1 x FPE
  • Dual GbE, 4 x SATA III, 2 x RS232/422/485
  • 6 x USB 3.0, 4 x USB 2.0
  • Extended operating temp. -40 to 85°C
  • Technical Profile
  • Specifications
  • Video
  • Certification
Introduction

 

PERFECTRON, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment.

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It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, PERFECTRON EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40 to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

Key Features
  • 9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
  • EBX SBC Dedicates PCIe/104 Type 2
  • Dual channel DDR4-2666 SO-DIMM with up to 128GB *, ECC for Xeon SKU
  • Three simultaneous displays with 48 bit LVDS + HDMI + DP
  • USB 3.0, TPM 2.0 and NVMe / PCIe Gen3x4 SSD
  • Dual GbE, SATA III, RS-232/422/485
  • M.2 M-Key 2280 and Full size mPCIe(one support SIM card)
What is Small Form Factor (SFF)?

 

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Small form factor computer is the crucial component that drives the entire system operation as they can fit into smaller spaces and consume less power. They can be packaged and mounted in diverse ways than larger boards. The reduction of size, weight, and cost (SWaP) has been continuously emphasised as more computer systems demand smaller processor and network connectivity solutions. As a result, application such as automation and transportation which demand more differently stackable ways often employ small form factors architecture.

 

 

DDR4 2466 128GB Optimised Performance

Since speed and power matters most in computing performance, OXY5741A is built in 4 x SO-DIMMs up to 128GB to deliver optimisation of the performance. Adding DDR4-128GB not only maximises CPU and computing performance, but also enables more robust and responsive virtual machines and applications. Taking advantage from the cutting edge DRAM technology, OXY5741A EBX XEON SBC can optimise system performance by accelerating the memory capacities of servers.

Ruggedised Open Standard PCIe/104 Facilitate Flexible Expansion

Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedised, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741A employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key (M-Key 2280 optional), and PCIe 3.0 x 4 NVMe. Additionally, OXY5741A provides 3.0 ports for data redundancy by supporting RAID 0/1.

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High Performance and Fast Storage

Today, ruggedised systems or computers are expected to possess speedy and smooth response times. In light of making these systems render high performance, NVMe protocol delivers a high-bandwidth and low-latency user experience. Moreover, via accessing a PCIe bus that supports a huge number of parallel command queues, NVMe can effortlessly access flash storage. This platform incorporates Intel® Xeon E-2276ME with 4 cores. OXY5741A supports up to 128GB of dual-channel DDR4 2400MHz memory and features an M.2 M-Key 2280 slot for NVMe / PCIE Gen3x4 high-speed PCIe SSD storage, thus offering extremely high data speeds for processing. The above features make OXY5741A an outstanding solution for applications that demand high performance in a compact EBX form factor. 

Board Placement
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System

 

 

CPU

Intel® Core™ i7-9850HE Processor

(6 Cores/12 Threads, 9M Cache, up to 4.40 GHz), 45W

Intel® Core™ i7-9850HL Processor

(6 Cores/12 Threads, 9M Cache, up to 4.10 GHz), 25W

Intel® Xeon® E-2276ME Processor

(6 Cores/12 Threads, 12M Cache, up to 4.50 GHz), 45W

Intel® Xeon® E-2276ML Processor

(6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W

Intel® Core™ i5-8400H Processor

(6 Cores/12 Threads, 8M Cache, up to 4.20 GHz), 45W

Memory Type

2 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC)

Chipset

CM246

BIOS Core

AMI UEFI BIOS

BIOS Flash

Super I/O

SPI Flash

ITE8786

TPM

TPM 2.0(SLB9665)

iAMT

iAMT 12.0

Watchdog

1-255 sec. or 1-255 min. software programmable and can be generate system reset

Expansion slot

 

 

M.2

1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)

Mini PCIe

2 x Full size (USB / PCIe and 1 x micro SIM Card)

FPE

1

PCIe/104

1 x TYPE 2

Display

 

 

Chipset

Intel® UHD Graphics 630

LVDS

Dual channel 24-bit LVDS, max resolution up to 1920 x 1080 @ 60Hz

Display Port

Multi-Display

Up to 4096 x 2304 @ 60Hz

Triple simultaneous displays with 48-bit LVDS+DP

Ethernet

 

 

Chipset

Intel® I210 & I219LM GbE LAN(10/100/1000 Mbps supported)

WOL

Yes

Boot from LAN

Yes for XPE

Audio

 

 

Codec

ALC888S

Rear I/O

 

 

Display Port

2

USB

4 x USB 3.0

LAN

2

Front I/O

 

 

LED

6 (HDD, 2 x LAN ACT+LINK) RED/GREEN LED

PW Button

1

USB

2 x USB 3.0

Internal I/O

 

 

USB2.0

4

GPIO

(4in/4out)

SATAIII

4 (0,1,5 RAID)

SATA Power 4  
DP 1  

Audio

1 (Line-out /Mic-in)

Serial

2 (RS-232/422/485 autoflow control)

DC connector 1

LVDS Inverter

1

LVDS connector

1

LPC 1

CPU Fan

1

Front Panel Control

Power LED, HD LED, Reset, Power Switch, Buzzer

Mechanical and Environmental

 

Form Factor

EBX

Power Type

DC-IN 12V

Power Consumption

180W

Dimension

146mm X 243mm

Operating Temperature

UT : -40 to 85

Storage Temperature

-40 to 85

Relative humidity

10% to 90%, non-condensing

Standard Compliance
Standard Compliance CE/FCC
OS
OS Support

Windows®10 64-bit

Linux(Support by request)