INS8267A
Micro-ATX Form Factor Intel® 13/12th Gen. Core™ i9/i7/i5/i3 processors
- Intel® Raptor Lake-S 13th/Alder Lake-S 12th i9/i7/i5/i3 125 W processor
- Intel® Q670 Chipset
- Intel® vPro technology support (Q670)
- 4x DDR4 U-DIMM up to 128GB
- 1 x PCIe X16 slot, 2 x PCIe X8 slot (x4 Lanes), 2 x M.2 2280/2210 M-key (NVME)
- Support triple display for 3 x DisplayPort
- Up to 6 x SATAIII (support RAID 0, 1, 5, 10)
- Up to 2 x Intel® Gigabit Ethernet
- Up to 7 x USB 3.2 Gen1, 4 x USB 2.0, 2 x COM ports
- ATX power input
- Operating Temperature : ET : -20°C ~ 70°C ; UT : -40°C ~ 85°C
- Technical Profile
- Specifications
- Introduction
-
INS8267A is a rugged Micro-ATX mother board boosted by Intel® Raptor Lake-S 13th /Alder Lake-S 12th with an LGA 1700 socket, featuring a hybrid Intel® P&E Cores technology which brings unprecedented performance in AI inference, Machine Learning and other high-computing multitasks.
Providing 1 x PCIe X16 slot, 2 x PCIe X8 slot and 2 x M.2 2280/2210 M-key, INS8267A supports demanding expansion cards such as graphic card for powerful graphics processing and high-speed NVMe for reliable storage which will be powerful pillar to support graphic-intensive program with high storage.
Further, compatible with the Wi-Fi 6E standard which delivers ultimate Wi-Fi performance with higher throughput and wider channels, INS8267A enables ultra-fast wireless connectivity to keep each connected device performing at an optimum level without compromising the flexibility of locations.
Last but not least, engineered to maintain high operation in the most intrigue environment, INS8267A is able to operate in low and high-heat climates ranging from -40°C ~ 85°C, guaranteeing the consistent high performance despite of ambient temperature variation.
Intel® Raptor Lake-S/ Alder Lake-S processors
Via fully-upgraded hybrid performance architecture (configuration of a mix of performance and efficiency cores) , the larger, performance-driven cores (P-core) handle compute-intensive and AI workloads, while the smaller, energy-efficient cores take care of high-density and scale-out workloads in the background. INS8267A features efficiency optimization of graphic performance, machine vision, and AI inference enhancement.
Rich I/O and Modern Manageability
Supporting up to 2 x LAN, 6 x SATAIII, 3 x Display ports 7 x USB 3.2 Gen and several I/O options, INS8267A offers various I/O and system-critical functions. Compatible with Intel vPro® platform and SATAIII with RAID, INS8267A enables to improve productivity through management control and strengthen data security by optimizing data transferring performance as well as fail-safe backup protections.
Ultimate Durability
Topping its power off with extended operating temperature of -40°C ~ 85°C and resistance to humidity, dust, shock and vibration, INS8267A shows high stability and reliability to meets the demand of 24/7 non-stop operating in the most critical environments through its robust structure.
- Block Diagram
System |
|
CPU |
13th/12th Gen Intel® Raptor Lake-S/Alder Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor / TDP 125W |
Memory type |
4 x 288-pin U-DIMM / DDR4 3200 MHz / Max. 128 GB (Non-ECC) |
Chipset |
Intel® H610 / Q670 |
Ethernet |
Intel® I219-LM Giga LAN + Intel® I225V 2.5 Giga LAN |
I/O Chipset |
Nuvoton NCT6796D-E |
TPM |
TPM Header (support optional TPM module) |
H/W Monitor |
Temperature Monitor / Voltage Monitor / Fan Monitor |
Watchdog |
1-255 sec. or 1-255 min. software programmable and can be generate system reset |
Smart Fan Control |
CPU Fan / System Fan |
Expansion Slot |
|
M.2 |
Q670 : M.2 2280 / 22110 M key(PCIe X4)/ M.2 2280 / 22110 M key (PCIe X2) H610 : M.2 2280 / 22110 M key(PCIe X2) |
PCIe Slot |
Q670 : PCIe 3.0 X16 slot/ 2 x PCIe 3.0 X8 slot (X4 Lanes) H610 : PCIe 3.0 X16 slot/ 1 x PCIe 3.0 X8 slot (X4 Lanes) |
Graphic |
|
Chipset |
Intel® UHD Graphics 770 |
Display Port |
Up to 4K (4096 x 2304) @60 Hz |
Ethernet |
|
Chipset |
Intel® I219-LM Giga LAN + 2 x Intel® I210-AT Giga LAN |
Audio |
|
Codec |
Realtek® ALC888-VR |
Rear I/O |
|
USB |
Q670 : 4 x USB 3.1 / 2 x USB 2.0 H610 : 2 x USB 3.1 / 4 x USB 2.0 |
Display port |
3 x DisplayPort 1.2 |
Audio |
1 x 6-stack Audio Jack |
LAN |
2 x RJ45(1 x GbE ; 1 x 2.5GbE) |
Internal I/O |
|
SATAIII |
Q670 :6 x SATAIII H610 :4 x SATAIII |
USB |
Q670 : 2 x USB 3.1 / 1 x USB3.1 TypeA / 2 x USB 2.0 H610 : 2 x USB 3.1 / 1 x USB2.0 TypeA / 2 x USB 2.0 |
Audio |
1 x Front Audio |
GPIO |
1 x MiAPI Header |
Serial |
2 x RS232 |
Fan |
1 x 4-pin CPU Fan Header / 3 x 4-pin system Fan Header |
Power |
1 x ATX 8pin / 1 x ATX 24pin |
Others |
1 x CMOSJumper / 1 x FIO header / 1 x SPI TPM header |
Mechanical and Environmental |
|
Form Factor |
Micro ATX |
Power Type |
ATX 8-pin + ATX 24-pin |
Dimension |
244mm x 244mm(9.6” x 9.6”) |
Operating Temperature |
ET : -20°C ~ 70°C UT : -40°C ~ 85°C |
Storage Temperature |
-40°C ~ 85°C |
Relative humidity |
10% to 95%, non-condensing |
Standard Compliance |
|
Standard Compliance |
CE/FCC Class B |
OS |
|
OS Support |
Windows® 10/11 64-bit Linux(Support by request) |