OXY5315A

3.5" SBC Intel^® Pineview N455 CPU with DDR3 SO-DIMM, Dual Display by VGA/LVDS, Dual GbE LAN, Audio, 8 x COM, 8 x USB, and 12V DC-in -40°C to 85°C

Intel^® Atom Pineview N455 onboard + Intel^® ICH8M PCH
Dual independent display: VGA, LVDS
Rich I/O interface with 8 COM, 8 USB, 2 LAN, 2 SATAII, and 1 x Compact Flash Typell Socket
Flexible expansion with 1 x miniPCIe
Support Single/dual Channel 18-bit LVDS
12V DC-in, 4-pin ATX power connector, AT/ATX mode support
Extended operating temperature. -40°C to 85°C

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Technical Profile
Specifications
CPU
SSD Performance

Introduction

OXY5315A is a 3.5” industrial motherboard, driven by Intel^® Atom Pineview N455 CPU onboard and ICH8M chipset. Extreme low power consumption of Processor Atom Pineview N455 plus Intel ICH8M chipset is only 6.5W and 2.4W respectively. The overall power consumption is as low as 8.9W! It supports AC/DC power convert function, which provides a more flexible power selection. VGA & CPU onboard design creates a higher ability to withstand vibration and shock. Extended temperature operation from -40°C to 85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 8 COM ports; 8 Bit DIO; 8 x USB; optional single/dual channel 18-bit/24-bit LVDS. With such extensive functions and powerful computing ability, OXY5315A can fulfill diverse needs of modern day display & monitor control applications.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5315A with the ability to comprehend present day automation, display, and other applications that require extensive I/O features. With 8 COM ports, 8 USB, 2 LAN, 2 SATAII and dual-display (VGA+LVDS), OXY5315A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5315A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

Thermal pad and heat sink are used to make up an effective thermal solution. For OXY5315A, the thermal pad is placed on top of the CPU, acting as a supportive medium to dissipate the heat to the surrounding atmosphere. The thermal pad is of the perfect thickness (3mm) to deliver the best performance. An aluminum heat sink is fixed on top of the thermal pad to quick the whole dissipation process.

Installation Instruction

Procedure: Place the thermal pad on top of the CPU, and then stick the heat sink upwards.

Thermal Pad
Thermal pad is widely used to aid the conduction of heat away from the component that needs to be cooled down (e.g. CPU) and into the heat sink.

To determine the effectiveness of a thermal pad, the unit “K” is applied. Most of the other companies in the embedded market employ materials under K10 for economic reason. Perfectron, with the target of reaching CPU full speed without throttling, incorporates only K17 military grade as our principle specification.
The thinner the thermal pad is the better effect it creates. The thickness of the thermal pad is crucial, be it too thick, the heat will cumulate and force the heat dissipated by the CPU to flow back.
With precise calculation, the thermal pad we implemented is 3mm in height.

Heat Sink
Heat sink is known for improving the distribution of heat. Our tailor-made heat spreader is made with and aluminum. It can dissipate the heat in the quickest fashion.

It contains 96% of aluminum, 48mm height and weighs 15g.
Thermal paste is applied to give mechanical strength to the bond between heat sink and heat source. It eliminates air from the surface area and optimizes the heat transfer between the two contact surfaces.
Dissipate heat quicker than copper owing to lower heat conductivity efficiency. (Copper: 402; Aluminum: 266)
Excellent performance in heat dissipation.

Operating Temp.
Can withstand extended temperature from -40°C to 85°C – board level

Operating Temp.
UT : -40°C to 85°C
System
CPU	Intel^® Atom™ N455 1.66 GHz
Chipset	Intel^® 82801HBM ICH8 Mobile (ICH8M)
Memory Type	1 x 204-pin SO-DIMM DDR3 800 MHz up to 2 GB
BIOS	AMI^® BIOS
Super I/O	ITE IT8781F
2nd Super I/O	Fintek F81216AD
Watchdog	1-255 sec. or 1-255 min. software programmable, can generate system reset
Expansion Slot
Mini PCIe	1 x miniPCIe for Gen2
Display
Chipset	Integrated Intel® GMA3150 Graphic core
Onboard VGA	Yes (Max. resolution 1400 x 1050 @ 60 Hz)
LVDS	Supports single channel 18-bit LVDS (Max. resolution 1366 x 768)
Dual Independent Displays Capability	VGA + LVDS
Audio
Codec	Realtek ALC662 High Definition Audio Codec *2W amplifier onboard
Ethernet
Chipset	2 x RTL8111DL GbE LAN (support 10/100/1000 Mbps for 2 x RJ45 ports)
WOL	Yes
Boot from LAN	Yes for PXE
Rear I/O
VGA	1 x 15-pin VGA connector (female)
Ethernet	2 x RJ45 ports (support 10/100/1000 Mbps for 2 x RJ45 ports)
COM	1 x RS-232/422/485 with 5V/12V selectable
	Serial Signals RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- RS422: TX-, RX+, TX+, RX-, GND, RS485: DATA-, DATA+, GND
USB	2 x USB 2.0
Reset Button	1
Internal I/O
SATA	2 x SATAII (3 Gb/s)
CF card	1 x CF socket by IDE interface
USB	6 x USB 2.0 ports by 2 x 5-pin header
COM	7 x COM ports COM2~COM4 ports support RS232 only with 5V/12V selectable by 1 x 10-pin header COM5~8 port support RS232 by 1 x 10-pin header
Audio	2 x 3-pin header for Mic-in/Line-in/Line-out 2 x 2-pin header for right and left Speaker-out
LVDS	20-pin connector
PS/2	2 x 3-pin header
Parallel Port	2 x 13-pin header
DIO	8-bit (4 in/4 out)
OS support list
Windows	Windows 7 x32、Windows 7 x64
Linux	Open SUSE 12.2、Debian 7.0.0
Mechanical and Environment
Form Factor	3.5" SBC
Power Type	12V DC-in, 4-pin ATX power connector, AT/ATX mode support
Dimension	146 x 102 mm (5.7" x 4")
Operating Temp.	UT : -40°C to 85°C
Storage Temp.	-40°C to 85°C
Relative Humidity	10% to 90%, non-condensing
Certification
MIL-STD-810G
Temperature Shock	MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle)
High Temperature	MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating )
Low Temperature	MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating )

Test Result

Device Model	OXY5315A	Test Result		Pass
Tester	Ian Huang
Diagram of curves		Test Temperature		Test Time
		High	0°C to 85°C	5Hours
		Low	-40°C to 0°C	2Hours
		Test Standard	Reference IEC60068-2
		Test Software	Burnin test v6.0
		Criteria	After testing, system can’t halt.

Test Configuration

Device	Configuration	Manufacturer	Part Number
CPU Type	Intel^® Atom™ N455 1.66GHz(6.5W)	Intel	N455
PCH	Intel^® 8280 1HBM ICH8 Mobile	Intel	ICH8
Memory	Innodisk 2GB DDR3 1333 W/T SODIMM	Innodisk
port2 SATAIII	Innodisk 128GB SATA SSD
LAN1	Realtek RTL8111E GbE LAN	Realtek	RTL8111E
LAN2	Realtek RTL8111E GbE LAN	Realtek	RTL8111E
Test Software	Burnin test v7.1、HD Tune v4.01、iperf、Passmark USB2.0 　Intel TAT 3.8.7.1104,CPU Z-1.67
Chamber	KSON THS-b4t-150 Chipeng SMO-3	KSON Chipeng	THS-b4t-150 SMO-3

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5315A for one hour, from 50°C to 85°C.