OXY5314A
3.5" SBC Intel® Tunnel Creek E660T + Topcliff EG20T with DDR2 onbord Memory Dual Display by VGA/LVDS, Dual GbE LAN, 4 x COM, 2 x USB, CAN Bus, and 12V DC-in -40°C ~ 85°C
- Intel® Tunnel Creek E660T CPU+ Intel® Topcliff EG20T
- Dual independent display support by VGA and LVDS
- Rich I/O interface with 4x COM, 2x USB, 2 LAN
- Flexible expansion with 1 x mPCIe
- 1x CAN Bus support
- 8 bit DIO (4 in/84out)
- Extended operating temperature. -40°C to 85°C
- 12V DC-in
- Technical Profile
- Specifications
- CPU
- SSD Performance
Introduction
OXY5314A is a 3.5” form factor single board computer, designed with Intel® Tunnel Creek E660T CPU and 1GB memory soldered onboard. Processor E660T supports single core 1.3 GHz, presenting extremely low power consumption 3.6W with great performance. With processor and memory soldered onboard can significantly enhance the resistance of vibration and shock. Extensive I/O interface with 4 COM ports, 2 USB ports and flexible expansion slot for one Mini PCIe can increase a variety of possibility for device connect ability. OXY5314A especially supports one CAN bus which can apply in transportation application. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. OXY5314A is rugged SBC and expected to be a good solution for automation and transportation industry.
Processor and Memory soldered on board provide maximum resistance of shock and vibration
With processor and memory soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor and memory soldering on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.
Rich I/O interface – Extensive Functionality
OXY5314A presents extensive I/O interface with 4 COM ports, 2 USB ports and two LAN ports that provide a variety of possibility for device connect ability. Besides, it supports flexible expansion slot for one Mini PCIe for extra module usage, one CAN bus and digital I/O enabling easy integration for in-vehicle infotainment and industrial automation usage.
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Operating Temp. |
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|---|---|
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UT : -40°C ~ +85°C |
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System |
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CPU |
Intel® Atom™ E660T 1.3 GHz |
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Chipset |
Intel® Topcliff EG20T |
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Memory Type |
1 GB DDR2 667/800 MHz memory IC onboard |
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BIOS |
AMI® BIOS |
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Super I/O |
SMSC SCH3114 |
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Watchdog |
1-255 sec. or 1-255 min. software programmable, can generate system reset |
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CPU |
Intel® Atom™ E660T 1.3 GHz |
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Expansion Slot |
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Mini PCIe |
1 x mini PCIe (half-size) for Gen2 |
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Display |
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Chipset |
Chrontel 7317B SDVO to VGA transmitter |
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VGA |
Yes (Max. resoultion 1280 x 1024 @ 70 Hz) |
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LVDS |
Supports signle channel 18/24-bit LVDS |
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Dual Independent |
VGA + LVDS |
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Audio |
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Codec |
Realtek ALC886 High Definition Audio Codec *2W amplifier onboard |
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Ethernet |
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Chipset |
2 x Intel® 82574IT GbE LAN (support 10/100/1000 Mbps for 2 x RJ45 ports) |
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WOL |
Yes |
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Boot from LAN |
Yes for PXE |
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Rear I/O |
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VGA |
1 x 15-pin VGA connector (female) |
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Ethernet |
2 x RJ45 ports (support 10/100/1000 Mbps for 2 x RJ45 ports) |
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COM |
1 x RS-232/422/485 with 5V/12V selectable |
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Serial Signals RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- RS422: TX-, RX+, TX+, RX-, GND, RS485: DATA-, DATA+, GND |
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USB |
2 x USB 2.0 |
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Internal I/O |
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SATA |
1 x SATAII (3 Gb/s) |
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CF card |
1 x CF socket by IDE interface |
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COM |
3 x COM ports |
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CAN Bus |
COM2~COM4 ports support RS232 by 1 x 10-pin header |
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|
1 x 10-pin header |
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LVDS |
20-pin connector |
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Audio |
1 x 6-pin header for Mic-in/Line-in/Line-out |
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SMBus |
1 x 2-pin header |
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DIO |
8-bit (4 in/4 out) |
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OS support list |
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Windows |
Windows XP x32、Windows XP x64 |
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Linux |
Fedora 14 |
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Mechanical and Environment |
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Form Factor |
3.5" SBC |
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Power Type |
12V DC-in, 4-pin ATX power connector, AT/ATX |
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Dimension |
146 x 102 mm (5.7" x 4") |
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Operating Temp. |
UT : -40 to 85°C |
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Storage Temp. |
-40 to 85°C |
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Relative Humidity |
10% to 90%, non-condensing |
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Certification |
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MIL-STD-810G |
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Temperature Shock |
MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle) |
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High Temperature |
MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating ) |
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Low Temperature |
MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating ) |
Test Result
| Device Model | OXY5314A | Test Result | Pass | |
| Tester | Ian Huang | |||
| Diagram of curves | Test Temperature | Test Time | ||
 |
High | 0~85°C | 5Hours | |
| Low | -40~-0°C | 2Hours | ||
| Test Standard | Reference IEC60068-2 | |||
| Test Software | Burnin test v6.0 | |||
| Criteria | After testing, system can’t halt. | |||
Test Configuration
| Device | Configuration | Manufacturer | Part Number |
| CPU Type | Intel® Atom™ E660T 1.3GHz(3.6W) | Intel | E660T |
| PCH | Intel® Topcliff EG20T | Intel | EG20T |
| Memory | 1GB DDR2 667/800 MHz memory IC onboard | ||
| port2 SATAII | Innodisk 128GB SATA SSD | ||
| LAN1 | Intel 82574IT GbE LAN | Intel | 82574IT |
| LAN2 | Intel 82574IT GbE LAN | Intel | 82574IT |
| Test Software | Burnin test v7.1、HD Tune v4.01、iperf、Passmark USB2.0 Intel TAT 3.8.7.1104,CPU Z-1.67 |
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| Chamber | KSON THS-b4t-150 Chipeng SMO-3 | KSON Chipeng | THS-b4t-150 SMO-3 |
Thermal Measurement
PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5314A for one hour, from +50 to +85°C.
