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OXY5314A

3.5" SBC Intel® Tunnel Creek E660T + Topcliff EG20T with DDR2 onbord Memory Dual Display by VGA/LVDS, Dual GbE LAN, 4 x COM, 2 x USB, CAN Bus, and 12V DC-in -40°C ~ 85°C

  • Intel® Tunnel Creek E660T CPU+ Intel® Topcliff EG20T
  • Dual independent display support by VGA and LVDS
  • Rich I/O interface with 4x COM, 2x USB, 2 LAN
  • Flexible expansion with 1 x mPCIe
  • 1x CAN Bus support
  • 8 bit DIO (4 in/84out)
  • Extended operating temperature. -40°C to 85°C
  • 12V DC-in
  • Technical Profile
  • Specifications
  • CPU
  • SSD Performance

Introduction

OXY5314A is a 3.5” form factor single board computer, designed with Intel® Tunnel Creek E660T CPU and 1GB memory soldered onboard. Processor E660T supports single core 1.3 GHz, presenting extremely low power consumption 3.6W with great performance. With processor and memory soldered onboard can significantly enhance the resistance of vibration and shock. Extensive I/O interface with 4 COM ports, 2 USB ports and flexible expansion slot for one Mini PCIe can increase a variety of possibility for device connect ability. OXY5314A especially supports one CAN bus which can apply in transportation application. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. OXY5314A is rugged SBC and expected to be a good solution for automation and transportation industry.

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Processor and Memory soldered on board provide maximum resistance of shock and vibration

With processor and memory soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor and memory soldering on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

Rich I/O interface – Extensive Functionality

OXY5314A presents extensive I/O interface with 4 COM ports, 2 USB ports and two LAN ports that provide a variety of possibility for device connect ability. Besides, it supports flexible expansion slot for one Mini PCIe for extra module usage, one CAN bus and digital I/O enabling easy integration for in-vehicle infotainment and industrial automation usage.

Operating Temp.

 

UT : -40°C ~ +85°C

 

System

 

CPU

Intel® Atom™ E660T 1.3 GHz

Chipset

Intel® Topcliff EG20T

Memory Type

1 GB DDR2 667/800 MHz memory IC onboard

BIOS

AMI® BIOS

Super I/O

SMSC SCH3114

Watchdog

1-255 sec. or 1-255 min. software programmable, can generate system reset

CPU

Intel® Atom™ E660T 1.3 GHz

Expansion Slot

 

Mini PCIe

1 x mini PCIe (half-size) for Gen2

Display

 

Chipset

Chrontel 7317B SDVO to VGA transmitter

VGA

Yes (Max. resoultion 1280 x 1024 @ 70 Hz)

LVDS

Supports signle channel 18/24-bit LVDS

Dual Independent
Displays Capability

VGA + LVDS

Audio

 

Codec

Realtek ALC886 High Definition Audio Codec *2W amplifier onboard

Ethernet

 

Chipset

2 x Intel® 82574IT GbE LAN (support 10/100/1000 Mbps for 2 x RJ45 ports)

WOL

Yes

Boot from LAN

Yes for PXE

Rear I/O

 

VGA

1 x 15-pin VGA connector (female)

Ethernet

2 x RJ45 ports (support 10/100/1000 Mbps for 2 x RJ45 ports)

COM

1 x RS-232/422/485 with 5V/12V selectable

 

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND,

RS485: DATA-, DATA+, GND

USB

2 x USB 2.0

Internal I/O

 

SATA

1 x SATAII (3 Gb/s)
1 x 3-pin power connector

CF card

1 x CF socket by IDE interface

COM

3 x COM ports

 

CAN Bus

COM2~COM4 ports support RS232 by 1 x 10-pin header

 

1 x 10-pin header

LVDS

20-pin connector

Audio

1 x 6-pin header for Mic-in/Line-in/Line-out

SMBus

1 x 2-pin header

DIO

8-bit (4 in/4 out)

OS support list

 

Windows

Windows XP x32Windows XP x64

Linux

Fedora 14

Mechanical and Environment

 

Form Factor

3.5" SBC

Power Type

12V DC-in, 4-pin ATX power connector, AT/ATX

Dimension

146 x 102 mm (5.7" x 4")

Operating Temp.

UT : -40 to 85°C

Storage Temp.

-40 to 85°C

Relative Humidity

10% to 90%, non-condensing

Certification

 

MIL-STD-810G

 

Temperature Shock

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle)

High Temperature

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating )

Low Temperature

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating )

Test Result

 Device Model  OXY5314A  Test Result  Pass
 Tester  Ian Huang
 Diagram of curves  Test Temperature  Test Time
5314  High  0~85°C  5Hours
 Low  -40~-0°C  2Hours
 Test Standard  Reference IEC60068-2
 Test Software  Burnin test v6.0
 Criteria  After testing, system can’t halt.

 

Test Configuration

 Device  Configuration  Manufacturer  Part Number
 CPU Type  Intel® Atom™ E660T 1.3GHz(3.6W)  Intel  E660T
 PCH  Intel® Topcliff EG20T  Intel  EG20T
 Memory  1GB DDR2 667/800 MHz memory IC onboard    
 port2 SATAII  Innodisk 128GB SATA SSD    
 LAN1  Intel 82574IT GbE LAN  Intel  82574IT
 LAN2  Intel 82574IT GbE LAN  Intel  82574IT
 Test Software  Burnin test v7.1、HD Tune v4.01、iperf、Passmark USB2.0
 Intel TAT 3.8.7.1104,CPU Z-1.67
   
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3

 

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5314A for one hour, from +50 to +85°C.

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OXY5314A_SSD