OXY5313A

Introduction

OXY5313A is a 3.5” industrial motherboard, driven by Intel® Atom Pineview D525 CPU onboard and ICH8M chipset. Extreme low power consumption of Processor Atom Pineview D525 plus Intel ICH8M chipset is only 13W and 2.4W respectively. Powerful dual-core operation and energy-saving low power design make OXY5313A an ideal candidate for display and automation applications. It supports AC/DC power convert function, which provides a more flexible power selection. VGA & CPU onboard design creates a higher ability to withstand vibration and shock. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 8 COM ports; 8 Bit DIO; 8 x USB; Single 18-bit LVDS. With such extensive functions and powerful computing ability, OXY5313A can fulfill diverse needs of modern day display & monitor control applications.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5313A with the ability to comprehend present day automation, display, and other applications that require extensive I/O features. With 8 COM ports, 8 USB, 2 LAN, 2 SATAII and dual-display (VGA+LVDS), OXY5313A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5313A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

Thermal pad and heat sink are used to make up an effective thermal solution. For OXY5313A, the thermal pad is placed on top of the CPU, acting as a supportive medium to dissipate the heat to the surrounding atmosphere. The thermal pad is of the perfect thickness (3mm) to deliver the best performance. An aluminum heat sink is fixed on top of the thermal pad to quick the whole dissipation process.

Installation Instruction

Procedure: Place the thermal pad on top of the CPU, and then stick the heat sink upwards.

 

Thermal Pad

Thermal pad is widely used to aid the conduction of heat away from the component that needs to be cooled down (e.g. CPU) and into the heat sink.
•To determine the effectiveness of a thermal pad, the unit “K” is applied. Most of the other companies in the embedded market employ materials under K10 for economic reason. Perfectron, with the target of reaching CPU full speed without throttling, incorporates only K17 military grade as our principle specification.

• The thinner the thermal pad is the better effect it creates. The thickness of the thermal pad is crucial, be it too thick, the heat will cumulate and force the heat dissipated by the CPU to flow back.
•With precise calculation, the thermal pad we implemented is 3mm in height.

Heat Sink

Heat sink is known for improving the distribution of heat. Our tailor-made heat spreader is made with and aluminum. It can dissipate the heat in the quickest fashion.
•It contains 96% of aluminum, 48mm height and weighs 15g.

•Thermal paste is applied to give mechanical strength to the bond between heat sink and heat source. It eliminates air from the surface area and optimizes the heat transfer between the two contact surfaces.

•Dissipate heat quicker than copper owing to lower heat conductivity efficiency. (Copper: 402; Aluminum: 266)

•Excellent performance in heat dissipation.

Operating Temp.

Can withstand extended temperature from -40°C to 85°C – board level