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Intel® QM77 Fanless Rugged System with Intel® Ivy Bridge Core™ i7/i5/i3 Processor, AMD E6760 GPU DPx4, 9V to 24V DC-in, Extended Temp. -20°C to 60°C

  • Intel® Ivy Bridge CPU + Intel QM77 PCH
  • Multi display: VGA, DVI, HDMI (dual independent display)
  • 4 x Display port (4*HD, Single 4K display)
  • Rich I/O interface with 5 COM, 8 USB, 2 LAN
  • 2 x 2.5” SATA HDD/SSD
  • Flexible expansion with 1 x miniPCIe, and 1 x PCI
  • 2 x RJ45 for Ethernet connection
  • 9-24V wide voltage DC-in design
  • Extended operating temperature. -20°C to 60°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution

PER6760A targets at applications that require multiple high resolution displays, with Core i CPU, the computing power is magnificent. It is capable of continually presenting superior 2.3 GHz clock speed without CPU throttling. For surveillance, control room, and TV wall solutions, multi-display is a necessary requirement, the GPU satisfies to this need but also creates substantial amounts of heat. PERFECTRON's unique heat dissipation technique is to incorporate heat pipes and sizeable heat sinks to make up complete fanless environment. Wide range DC in put design with ATX power supply from 9V to 24V can protect the system from sudden current fluctuation. In an effort to permanently vanquish the malfunction due to crash and collision, PER6760A is equipped with four rubber foot stands at the front side to prevent possible damages to I/O and power switch. With industrial grade handles assembled on dual sides of the system, easy installation and utmost mobility are warranted. AMD E6760 GPU greatly leverages the GPU power to provide vivid and lively displays both clone & extended modes! Supports wide range power input 9V~24V DC-in (By terminal block)






Integrated thermal solution – the incorporation of four pure copper heat pipes and a copper heat sink

INS8335A, with its dynamic 4-core 45W core i7-3610QE processor, demands an equal high level thermal solution. To achieve maximum heat dissipation, the design and implementation of heat pipes is the golden key. In this case, a copper heat sink and passively cooled enclosure is implemented to establish an effective dissipation environment. The structure of four pure copper heat pipes is to ensure supreme thermal efficiency. The heat pipes are capable of prompt dissipation of the heat generated by the CPU’s inner core while it’s computing. According to Perfectron’s testing result, each pure copper heat pipe has the ability to dissipate 9w of heat. The combination of four heat pipes pushes the dissipation ability to a new level. Our tailor-made, precision-aimed integral structural heat sink and embedded heat pipes constitute an excellent fanless thermal solution. When the CPU hits 100% full potency, the implementation of four 6mm (minimum) pure copper heat pipes can keep it running at full speed – 2.3 Ghz!


Effective cooling devices for maximum heat dissipation

Perfectron’s unique heat sink and heat pipe are designed with precision. Each of the key heat-dissipating components is tailor-made in accordance with different interior and exterior structure. Unlike traditional solutions that utilize aluminum as the dissipating media for CPU and fin. We insist on incorporating 99% pure copper heat spreader, which is eight times higher in density than aluminum. Our tailor-made pure copper heat spreader is treated with the most precise CNC technology, cutting four 6.1mm wide track so that the 6mm wide heat pipes can fit seamlessly. Compared with conventional solid heat conductors, such as aluminum, copper, granite, and graphite, of which thermal conductivity ranges from only 250 W/m•K to 1,500 W/m•K, Perfectorn’s effective heat pipe design, with impressively high thermal conductivity (5000 W/m•K to 200000 W/m•K) that is 40 times higher than standard aluminum, is guaranteed to charge the system to the maximum turbo speed with minimum overall impact.





System main board: Mini-ITX SBC INS8335A

1.Ever powerful Intel Core i7 CPU

Rugged system demands an even stronger heart to pump it through all types of tough applications. Powered intel i7 CPU, both the computing power and the rugged ability are tightly secured.

2.Industrial handles meet ergonomic design

By placing two industrial grade, extremely reliable handles on the side, the system can be installed and moved with ease.

3.Rubber Foot Stands Design

Four rubber foot stands are installed in the front to protect front I/O and power switch from collision

4.Comprehensive thermal design

PER6760A incorporates four pure copper heat pipes and a copper & aluminum passive heat spreader. On the two sides of the system are aluminum heat sinks to push the dissipation ability to a complete new level.

GPU: AMD E6760

Mighty Graphic Power

E6760 power GPU from AMD endows PER6760A with the ability to support four independent Display Ports. With each port covering up to four HD, Single 4K display resolution.

 • Supports Intel® 22nm Ivy Bridge Processor socket Type i7i5/i3

 •Multi display: VGA, DVI, HDMI (dual independent display)  

 •4 x Display port (4*HD, Single 4K display)I

 •Dual GbE LAN ports  
 •4 x USB 3.0/ 4 x USB 2.0  
 •5 x COM ports (3 x RS232, 2 x RS232/422/485)  
 •Supports wide range power input 9V~24V DC-in (By terminal block)  
 • Supports extended temp. -20 to +60°C  



Operating Temp.

-20°C to 60°C


CPU Type

Intel® 22nm Ivy Bridge Processor (Mobile) socket (rPGA988) Core™ i7-3610QE 2.3 GHz (6M Cache, 45W)

Core™ i5-3610ME 2.7 GHz (3M Cache, 35W)

Core™ i3-3120ME 2.4 GHz (3M Cache, 35W)


Intel® QM77

Ethernet Chipset

Intel® 82579LM & 82574IT GbE


2 x 204-pin SO-DIMM support up to 16 GB dual channel DDR3 1333/1600, Non-ECC

Expansion Slot

1 x Mini-PCIe, 1 x PCI

Storage Device

2 x 2.5" SATA HDD/SSD

Front I/O

Power Button


Power LED





2 x RS232/with 5V/12V selectable

1 x RS232

1 x RS232/422/485


4 x USB 2.0

Rear I/O










2 x RJ45


Mic-in, Line-in, Line-out


1x RS232/422/485 with 5V/12V selectable


4 x USB 3.0


Reserved two antenna holes

Power Input

9V to 24V DC-in (by terminal block)

Mechanical and Environment

Power Requirement

9V to 24V DC-in

Dimension (W x D x H)

370 x 245 x 160 mm

(14.57" x 9.65" x 6.3")

Operating Temp.

-20°C to 60°C (ambient with air flow)

Storage Temp

-20°C to 80°C

Relative Humidity

10% to 90%, non-condensin

Test Result
PER6760A_CPU performance_01      
Test Configuration
Device  Configuration  Manufacturer  Part Number

 Intel® Core™ i7-3610QE 2.3 GHz (6M Cache, 45W)

 Intel   i7-3610QE
 PCH  Intel® QM77 Express Chipset  Intel  QM77
 Memory1  Innodisk SODIMM 4GB DDR3 1333 W/T M3SN-
 Innodisk  M3SN-4GMJDI09-D
 Memory2  Innodisk SODIMM 4GB DDR3 1333 W/T M3SN-
 Innodisk  M3SN-4GMJDI09-D
 port1 SATAIII  Innodisk 2.5” SATA SSD 3MG2-P 128GB  Innodisk  DGS25-A28D81SW1QC-D26
 Graphic Card  AMD Radeon E6760 GPU 600MHz 1GB DDR5  AMD  Radeon E6760
 USB3 ~ USB4  Passmark Loopback Plugs for USB 3.0    
 LAN1  Intel® 82579LM GbE LAN  Intel  82579LM
 LAN2  Intel® 82574IT GbE LAN  Intel  82574IT
 Test Software  Burnin test v6.0、HD Tune v4.01、iperf、Passmark
 USB3.0 Intel Extreme Tuning Utility
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3


Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in PER6760A-ET-i7-4700EQ for one hour, from +50 to +85°C.




Effective cooling solution for maximum heat dissipation:

PERFECTRON implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, PER6760A can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C

P6760A pic01


Large Surface Aluminum Heat Sink
Heat sinks of significant volume provide extreme dissipation rate. PER6760A, with the top cover functioning as heat sink, can quickly and efficiently release the heat.

 •The top cover heat sink is 40mm in height and is made of aluminum.

Thermal Pad
After countless experiments, PERFECTRON’s experienced engineer team has learned valuable lessons about the perfect thickness of thermal pad from failures.

 •Precise design of thermal pad: the gap between CPU die and heat sink should be less than

Copper & Aluminum Heat Spreader
 •The outer layer contains 96% of aluminum, the height is 23.5mm and it weighs 142g.

 •The inner layer contains 99.9% of copper, the height is 23.5mm and it weighs 173g.

Pure Copper Heat Pipe

 •Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance.
Two-phase heat transfer involves the liquid-vapor phase change of a working fluid. 

 •The longer ones are 365mm in length, 99.9% purity of copper. 

 •The shorter ones are 157mm in length, 99.9% purity of copper. 

 •High heat conductivity efficiency up to 5000.

Dual Sided Aluminum Heat Sink

 •The heat sink each weighs 1067.3g, and the height is 30.8cm 

 •The heat conducted by the heat sink will be dissipated by the aluminum heat sink placed on
the two sides. 

 •Aluminum has higher efficiency in heat dissipation.


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