ROC235B

ROC235B - Intel® QM77 1U 100V-240V Fanless Rugged System

19" 1U  Intel® QM77 i7-3610QE Rugged Server , 100V to 240V AC-Input, Extended Temp. -20 to 60°C

  • Supports Intel® 22nm Ivy Bridge Processor
  • i7-3610QE/I5-3610ME/i3-3120ME
  • 2 x DDR3 SO-DIMM up to 16 GB
  • Supports 2 x 2.5" Easy Swap SSD
  • Muliti-display:1 x DVI-D, HDMI, VGA
  • Dual GbE LAN ports
  • 4 x USB 3.0 / 2 x USB 2.0
  • 100V~240V AC-in
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  • Technical Profile
  • Specifications
  • CPU
  • SSD Performance
  • Thermal Solution
Introduction

ROC235B is an industrial 19” 1U Rack-mount fanless rugged system, especially designed for demanding applications that require supreme quality and reliability. Powered by Intel® Ivy Bridge i7/i5/i3 (i7-3610QE, i5-3610ME, i3-3120ME) CPU and QM77 chipset, the power consumption is (45W for i7 and 35W for both i5 & i3), 4.1W for QM77 PCH. With 44mm of height and 380mm of depth, it’s fit for rack mount, wall mount, and standalone application. Heat pipes and heat sinks are constructed on both component and system levels. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling. ROC235B’s power design is for 100V – 240V AC-in, which allows a flexible usage. ROC235B meets the demands of industrial embedded applied computing applications including the industrial PC platform, transaction, multimedia workstation, vehicle PC, and network server.

 

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System main board: Mini ITX INS8335A

1. Rich I/O, Infinite Possibility

ROC235B contains rich indicators including power, HDD and LAN LED in the front side. For easy integration with all sorts of systems, versatile I/O interface can be found on the rear side. It supports three display (HDMI/VGA/DVI), audio Mic-in, Line-out, 1 x COM, 2 x Ethernet LAN and 6 x USB. 2 x 2.5” Easy Swap SSD design pushes the expansion ability to the utmost.



2.  AC-in Power Design

ROC235B supports 100 to 240V AC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.



3. Ultra Slim Size

ROC235B is a compact yet capable industrial grade fanless system. With only 380mm in depth and 44mm (1.73”) in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.

Operating Temp.

-20°C  to 60°C
System

CPU

Intel® 22nm Ivy Bridge Processor (Mobile) socket(rPGA988)

Intel® Core™ i7-3610QE (4C x 3.3 GHZ), 6M L2 cache (45W)

Intel® Core™ i5-3610ME (2C x 2.7 GHZ), 3M L2 cache (35W)

Intel® Core™ i3-3120ME (2C x 2.4 GHZ), 3M L2 cache (35W)

Chipset

Intel® QM77 Express Chipset (Intel® BD82QM77 PCH)

Memory Type

2 x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 16GB

Expansion Slot

2 x PCI by PCIe x 1, from PCH

1 x Mini PCIe for GEN2

Storage Device

2 x 2.5" SATA HDD/SSD (Easy Swap 2.5" HDD cage)

Supports RAID 0,1
Front I/O

Power Button

1

Power LED

1

HDD LED

1

USB

2 x USB 2.0

Reset

1
Rear I/O

VGA

1 x 15-pin VGA connector (female)

DVI-D

1 x 25-pin DVI-D connector (female)

HDMI

1 x 19-pin HDMI A Type connector (female)

Ethernet

Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

Audio

Mic-in, Line-out

COM

1 x RS232/422/485

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND,

RS485: DATA-, DATA+, GND

USB

4 x USB 3.0
OS support list

Windows

Windows 7 x32/ x64、Windows 8.1 x32/ x64、Windows 10 x32/ x64TBD

Linux

Open SUSE 12.2、Ubuntu 12.04
Mechanical and Environment

Power Requirement

100V to 240V AC-in

Dimension

440 x 44 x 380 mm (17.32" x 1.73" x 14.96")

Operating Temp.

-20°C to 60°C (ambient with air flow)

Storage Temp.

-20°C to 80°C

Relative Humidity

10% to 90%, non-condensing
Certifications

EMC

CE, FCC
Test Result

235B

Test Configuration

Test Configuration 235B

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in INS8321B for one hour, from +50 to +85°C.

ROC235Bcpu

 

SSD

Efficient thermal solution for maximum heat dissipation:

What composes of a perfect thermal solution? With ROCS235B, it’s all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. Honeycomb dissipating vents are constructed on the top and the sides to increase the dissipating area. The honeycomb cells can achieve faster heat dissipation without occupying much space. Two heat spreaders and two heat sinks are installed to create a magnificent ventilating structure. Six heat pipes are implemented to conduct the heat to the thermal modules on the two sides of the system. This phenomenal combination can bring out the best dissipating effect.

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Honeycomb Dissipating Vents

The honeycomb vents are pre-drilled in rigid aluminum frames to fasten thermal convection and the airflow that will astonishingly enhances ventilation. The enclosure features large, open honeycomb vents on the top, sides, front and back instead of fan solution that allows natural convection cooling that gather dust easily. This heat dissipating design can dispel heat quickly through the honeycomb cells without occupying much space. The unique design enables greater airflow through the entire area of the honeycomb surface. The metalized polymeric honeycomb also brings up excellent rigidity and pressure resistance.

 

Passive Heat Spreader

Heat spreader is known for improving the distribution of heat. Our tailor-made heat spreader is made with precision and consideration to every detail.

  • It contains % of aluminum, the height is mm and it weighs g.
  • Excellent performance in heat absorption

 

Dual Sided High Efficiency Thermal Modules

Dual Sided Thermal Modules can transmit the heat transferred by the heat pipes. Fen shaped design helps to emit the heat to the surrounding air, then release through the honeycomb dissipating vents on the front, back, and the sides.

 

Six Copper Heat Pipes

Six heat pipes are installed to ensure 100% tight integration for superior heat dissipation. Copper heat pipes transfer heat from the heat sources (e.g. CPU, chipset) to the thermal modules on the sides. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

  • 8.0 mm diameter heat pipe, 99.9% purity of copper
  • High heat conductivity coefficient up to 5000!

 

Aluminum Heat Sink

Heat sink is known for its ability to improve the distribution of heat. Our tailor-made heat sink is made with aluminum. It can dissipate the heat in the quickest fashion.

  • It contains 96% of aluminum, 48mm in height and weighs 103.5g.
  • Consumes shorter heat dissipating time owing to lower metal density

Better performance in heat dissipation

 

INS8335A

INS8335A is a Mini-ITX form factor industrial motherboard, powered by Intel® Ivy Bridge 22nm processor and QM77 chipset. Processor i7-3610QE plus Intel® QM77 chipset consumes only 45W and 4.1W individually. It supports four-core that can turbo up to eight-core. Extreme computing power and reliability are guaranteed by this powerful combination. Clock speed can boost from 2.3 GHz to 3.3 GHz. Turbo Boost – Full speed operation from 2.3GHz up to 3.3GHz