PERFECTRON, a visionary designer and manufacturer of extended temperature and rugged embedded computer has launched new EPIC rugged SBC - OXY5638A. OXY5638A is powered by Intel® Broadwell-U 14nm Processor, Core™ i3-5010U (15W), Core™ i5-5350U (15W), Core™ i7-5650U (45W), providing dual-core and quad-core options, which integrates 64GB SATA NAND drive onboard and supports two XR-DIMM up to 16 GB for memory in a compact EPIC form factor. With the strict extended temperature component selection standard and superb power circuit & layout optimization, OXY5638A is the real extended temperature motherboard that can operate 

effectively in harsh environments ranging from -40 to 85°C.

On top of the rugged design, all interfaces of OXY5638A are specially designed by pin headers that benefits engineers on design it for high IP proof water/dust level rugged computer and panel PC while maintain compact volume which is key factor for applications like aircraft, land vehicle, etc. Follows the EPIC standard, OXY5638A equipped with one PCIe/104 connector, which can easily expand extra interface module in the consideration of highest resistance of shock and vibration. The rich-featured board that can be applied to cater various I/O requirements, which deliversexcellent computing performance at minimal power consumption as well as advanced visual processing performance and can provide perfect solutions for industrial automation, transportation, energy, defense and high-end digital signage applications. 

Excellent Performance of Intel® Broadwell-U

Intel® Broadwell is Intel's fifth generation of Core-series processor, it takes its predecessor's CPU architecture (Intel® Haswell) and moves to a new manufacturing process (14nm). This 5th generation Intel® Broadwell processor pack substantial performance into an ultra low-power package, this low-power multi-chip package (MCP) combines a 64-bit, multicore processor and a platform controller hub (PCH) onto a common package substrate to deliver PC-class performance, HD graphics, and high-quality sound for space- and power-constrained embedded applications. Built on Intel’s industry-leading 14nm process technology, this MCP is compatible with platforms based on 4th generation Intel® Core™ processors. It is the first Intel chip to fully support DirectX 11.2 as well as OpenCL 1.3/2.0 and OpenGL 4.3. Video will output natively via DisplayPort 1.2 or HDMI 1.4a. The new manufacturing process gives Intel the ability to reduce power consumption, improve clock speed and increase performance. its chips is 30% more efficient than Intel® Haswell , using 30% less power while providing slightly better performance at the same clock speed. Intel® Broadwell comes with new Intel® HD Graphics which delivers stunning and responsive visuals, including ultra HD 4K display andadditional codec support.

High Scalability I/O design

For those who looks for high scalability I/O design mother board, OXY5638A provides diverse flexibility in I/O configurations by reserving the PIN header, completely meet different embedded demands from clients. OXY5638Acomprise rich I/O connectivity including: four COM ports, six USB ports, two Gigabit LANs, two SATAIII, and features multiple displays, 2 x DP and VGA connectivity ports with dual- channel 24-bit LVDS. All these extensive I/O can help system integrators to develop solutions quicker and easier for high IP level demand with M12 type connectors. Aiming at the mobile device market, OXY5638A offers optimal choices for multi-function, such as onboard SIM Card slot for 3.5G 

connectivity and onboard Pen Mount 6000 resistive touch 

controller for connecting touch panel. The versatile expansion 

compatibility also includes two full-size mini PCIe that could add 

on additional I/O or wireless network modules.

Extended with StackPC (PCIe/104) connector for ultimate I/O 

& features expansion

The StackPC (PCIe/104) Specification defines new approach to stackable systems design and development. The specification includes all valuable heritages of PCIe/104 standards along with the new features of StackPC connector.

The main competitive distinction of the StackPC connector is the combination of most popular low speed interfaces such as USB, COM, CAN,SPI, LPC and high speed SATA, Gigabit Ethernet and PCI-Express x1, x4 within one stack expansion connector. By PCIe/104 stacking method, the system can achieve thin gap between function module and OXY5638A and superior resistance of shock and vibration.

Intel® HD Graphics 

New generation Intel® Broadwell-U processor integrates the Intel HD Graphics 6000/5500 for excellent graphics computing performance in HD videos with exceptional clarity, easily view. Depending on the specific CPU, the maximum GPU frequency varies between 950 and 1000 MHz. Similar to the CPU core, the GPU architecture (Intel Gen 8) has been thoroughly revised for improvedperformance-per-clock. In addition, the GPU benefits from faster memory speeds up to LPDDR3-1866 (Haswell: DDR3-1600). The HD Graphics 6000 represents the top-end version of the Broadwell GPU family and consists of two slices with 48 Execution Units (EUs) clocked at 300 - 1000 MHz. All Broadwell GPUs support OpenCL 2.0 and DirectX 11.2. The video engine can now decode H.265 using both fixed function hardware as well as available GPU shaders. Up to three displays can be connected via DP 1.2/eDP 1.3 (max. 3840 x 2160 @ 60 Hz) or HDMI 1.4a (max. 3840 x 2160 @ 24 Hz). Enthusiasts looking for the best visual experience, Intel® HD Graphics would be the best choice. 

MIL-STD-810G Certificated

OXY5638A meets MIL-STD-810G for mechanical shock and vibration, this rugged board is designed and tested to withstand wide extended temperature (-40° to +85°C). With military used XR-DIMM type and soldered-on 64 GB SATA NAND drive, OXY5638A provides ultra ruggedization using in harsh environment.

Main Features:

• Intel® Broadwell-U (SoC) Core™ i7-5650U/ i5-5350U/i3-5010U BGA Processor
• 2 x XR-DIMM slot support up to DDR III 16GB
• 64 GB SATA NAND drive on board
• 1 x PCIe/104 (1 x PCIe_4, 4 x PCIe_1), 2 x mPCIe
• Dual Intel® GbE LAN ports (pin header)
• 2 x USB 3.0, 4 x USB 2.0 (pin header)
• 4 x COM ports (3 x RS232, 1 x RS232/422/485) (pin header)
• 1 x LVDS, 2 x DP (pin header)
• Support 12V DC-in
• Extended Temperature -40 to +85°C
• MIL-STD 810G compliant