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SCH-3X1

IEC-61850-3 , IEEE-1613 Substation Fanless Computer, with Intel® Core™ 9th Gen. Coffeelake-R i7-9700TE Processor, Operating Temperature -20°C to 60°C

  • Intel® Core™ i7-9700TE 
  • 2 x DDR4 2666MHz, SO-DIMM up to 64GB
  • 2 x 2.5”Easy swap SSD Tray
  • 2 x PCIe expansion slot (PCIe Gen3.0 x 8)
  • 2 x RJ45 LAN
  • 6 x USB3.0, 2 x USB2.0, 1 x DP , 1 x DVI-I , 1 x HDMI
  • 2 x RS232 / 422 / 485 (Support Power 5V / 12V)
  • Operation Temperture : -20°C to 60°C
  • Technical Profile
  • Specifications
  • Order Information
  • CPU
  • Certification

Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.

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As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH-3X1. Powered by Intel 9th Gen. Core i7-9700TE processor, SCH-3X1 owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 2 x LAN port and 2 x COM, SCH-3X1 is an undoubtedly best choice for Gateway application in Substation.

 

GPU

 

 

SCH-3X1 Rear IO

 

(1)Security Redundancy

Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.

 

(2)Network Redundancy

PRP/HSR network is an efficient and cost effective solution to construct a seamless/bumpless communication infrastructure.

 

 

(3)Rich communication Interface

In advantage of SCH-3X1’s diverse I/O, 2 x COM (All support RS232/422/485), 6 x USB3.0, 2 x LAN, the SCH-3X1 system can meet all clients’ communication requirement.

 

(4)IEC-61850-3

IEC 61850 defines the communication protocols for intelligent electronic devices at electric substations. IEC-61850-3 defines the complete testing requirement for the equipment which conforms to the standard.

 

 

(5)IEEE-1613

Detail environment and testing requirements for communications networking devices in electric power substations.

 

(6)Extreme Operating Temperature

Ensure high reliability and stability while operating under a harsh environment such as temperature from -20°C up to 60°C

 

(7)Ultra Wide Voltage Support

9V-48V, a very wide range voltage of DC-input capability, allows users to adopt all kinds of working site and applications scenario.

 

 

 

 

Why IEC-61850 Is Necessary

Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).

Substation Main Features
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System
 
CPU Intel® 9th Core™ i7-9700TE, 8C, 1.8/2.8GHz, 12MB cache, TDP 35W
Chipset Intel®C246
Memory Type DDR4-2666MHz, 2 x 260-pin SO-DIMM, Max 64GB
Expansion Slot 2 x PCIe 3.0 x 8
Storage Device 2 x 2.5”Easy swap SSD Tray
Front I/O
 
Power Button 1 x Power Button w/Indicator LED
LED 1 x PWR LED ; 1 x HDD LDD
HDMI 1 x HDMI 1.4
USB 2 x USB3.0
Rear I/O
COM 2 x RS232/422/485 (Support Power 5V/12V)
Ethernet 2 x RJ45
USB 4 x USB3.0, 2 x USB2.0
PS/2 1
SidplayPort 1 x DP1.2
DVI-I 1 x DVI-I
Terminal Block

1 x 2Pin Terminal Block Remote Power ON/OFF

1 x 2Pin Terminal Block Remote Reset

1 x 4Pin Terminal Block External FAN connector

1 x 3Pin Terminal Block Power input

Audio 1 x Mic-in, 1 x Line-out
DC-IN 1 x 9~48V
Mechanical and Environment
Dimension( W x D x H ) 170 x 264 x 250 mm
System Design Fanless
Mounting Rackmount Cube
Operating Temp. -20°C to 60°C(35W CPU)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
OS support list
Windows Windows 10 64 Bit
Linux Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2(By Request)
Certification
EMC CE . FCC Certification
Green Product RoHS, WEEE compliance

SCH-3X1

IEC-61850-3 , IEEE-1613 Substation Fanless Computer with Intel® Core™ i7-9700TE, 2 x 2.5” Easy swap SSD Tray, 2 x PCIe expansion slot, 2 x RJ45 LAN , 6 x USB 3.0 , 2 x USB 2.0 , 1 x PS/2, 1 x DP , 1x DVI,1 x HDMI , 2 x COM(RS232/422/485), 1 x Mic-in / 1 x Line-out, 9~48V DC-IN, 2Extend Temp -20 to 60°C

Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)

Thermal Point \ Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

   

16

58

68

75

91

CPU Die

   

11.8

38.6

71.9

76

81.5

CPU Heat sink

   

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

   

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

   

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

3.15 3.02

3.02

2.68

2.57

2.45

2.41

Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)

Thermal Point \ Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

   

16

77

95

99

100

CPU Die

   

11.8

38.6

71.9

76

81.5

CPU Heat sink

   

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

   

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

   

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

2.83 2.85

2.66

2.97

2.26

2.18

2.19

Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)

Test 50°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100%CPU Loading
with Graphic

50°C with hot air flow

71.4

68.8

100

3.1 GHz

100%CPU Loading
without Graphic

50°C with hot air flow

70.4

73.2

100

3.2 GHz

Test 60°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading
with Graphic

60°C with hot air flow

76.8

81.5

100

2.99 GHz

100% CPU Loading
without Graphic

60°C with hot air flow

75

79.6

100

3.15 GHz

Test 50°C with no air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading
with Graphic

50°C without air flow

78

81.1

100

3.05 GHz

100% CPU Loading
without Graphic

50°C without air flow

77

81.1

100

3.06 GHz