• Rugged COTS Computer System
    • SR100
    • Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7 Haswell Processor, 9V to 36V DC-in, Wide Temp. -40 ~ 70°C
    • •4th Generation Intel® Core™ i7 Haswell processors (BGA)
    • •XR-DIMM up to 8 GB RAM
    • •Onboard uSSD SATAIII up to 64 GB
    • •Multi-Displays by 2 x DP, 1 x DVI-I
    • •2 x mPCIe Expansion slot (One Co-Layout with mSATA)
    • •2 x PCIe Intel® Gigabit Ethernet
    • •4 x USB 3.0, 1 x COM ports
    • •9V~36V DC-in with power delay on/off
    • •Extended Temperature -40 to 70 °C


    Effective cooling solution for maximum heat dissipation:
    PERFECTRON implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100 can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C

     

     

    Patent Designed Aluminum Heat Sink
    The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height

    and weighs 1039 g

    Pure Copper Heat Pipe
    The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

    •8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper

    •High heat conductivity coefficient up to 5000

     

    Copper Heat spreader
    Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

    •99.9% purity of copper, weigh 470 g

     

    OXY5737A

    EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.

    Copper Heat spreader
    Copper heat spreader directly touches the heat source- processor and chipset, which absorb heat rapidly and transfer to heat pipe.

    •99.9% purity of copper, weigh 80g and consume 80x45x3 mm

    •3 mm height to fulfill the gap between mainboard and heatsink enclosure